Datasheet > GDPXA250B2C400

GDPXA250B2C400

更新时间： 2024-02-26 08:33:51

品牌	Logo	应用领域
英特尔 - INTEL		/
页数	文件大小	规格书
46页	675K
描述
Multifunction Peripheral, CMOS, PBGA256, MBGA-256

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技术参数
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GDPXA250B2C400 技术参数

生命周期：	Obsolete	包装说明：	BGA,
Reach Compliance Code：	unknown	地址总线宽度：	26
边界扫描：	YES	总线兼容性：	I2C; I2S; IRDA; UART; USB
外部数据总线宽度：	32	JESD-30 代码：	S-PBGA-B256
长度：	17 mm	I/O 线路数量：	81
端子数量：	256	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装形状：	SQUARE
封装形式：	GRID ARRAY	座面最大高度：	2 mm
最大供电电压：	3.6 V	最小供电电压：	3 V
标称供电电压：	3.3 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子形式：	BALL	端子节距：	1 mm
端子位置：	BOTTOM	宽度：	17 mm
Base Number Matches：	1

GDPXA250B2C400 数据手册

Electrical, Mechanical, and Thermal Specification — PXA250 and PXA210

1.0

About this Document

This is the Electrical, Mechanical, and Thermal Specification datasheet for the Intel^®PXA250 and

PXA210 applications processors. This datasheet contains a functional overview, mechanical data,

package signal locations, targeted electrical specifications (simulated), and bus functional

waveforms. Detailed functional descriptions other than parametric performance is published in the

Intel® PXA250 and PXA210 Applications Processors Developer's Manual. Refer to Table 1,

“Related Documentation” for a list of documents that support the PXA250 and PXA210

applications processors.

Table 1. Related Documentation

Document Title

Order / Contact

Intel Order # 278522

Intel® PXA250 and PXA210 Applications

Processors Developer's Manual

Intel® XScale^TMMicroarchitecture for the PXA250

and PXA210 Applications Processors Developer's

Manual

Intel Order # 278525

Intel Order # 278523

Intel® PXA250 and PXA210 Applications

Processors Design Guide

2.0

Functional Overview

The PXA250 and PXA210 applications processors provide high integration, high performance and

low power consumption for portable handheld and handset devices. These applications processors

incorporate Intel’s XScale^TMMicroarchitecture based on the ARM* V5TE architecture. Refer to

the Intel® XScale^TMMicroarchitecture for the Intel® PXA250 and PXA210 Applications

Processors Developer's Manual for implementation details, extensions, and options implemented

by Intel’s XScale^TMMicroarchitecture.

The applications processor’s memory interface supports a variety of memory types that allow

flexibility in design requirements. Hooks for connection to two companion chips permit glueless

connection to external devices. An integrated LCD display controller provides support for displays,

and permits 1, 2 and 4 bit grayscale and 8 or 16 bit color pixels. A 256-byte palette RAM provides

flexibility in color mapping.

A rich set of serial devices as well as general system resources provide enough compute and

connectivity capability for many applications. For details on the programming model and theory of

operation of each of these units, refer to the Intel® PXA250 and PXA210 Applications Processors

Developer's Manual. For the applications processor’s block diagram refer to Figure 1,

“Applications Processor Block Diagram” on page 8.

Datasheet

1...4 5 678 9 10...46

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与GDPXA250B2C400相关器件

型号	品牌	描述	获取价格	数据表
GDPXA255A0C400	INTEL	Microprocessor, 32-Bit, 400MHz, CMOS, PBGA256, 17 X 17 MM, 1.75 MM HEIGHT, PLASTIC, BGA-25	获取价格
GDPXA255A0E300	INTEL	Microprocessor, 32-Bit, 300MHz, CMOS, PBGA256, 17 X 17 MM, 1.75 MM HEIGHT, PLASTIC, BGA-25	获取价格
GDPXA255A0E400	INTEL	Electrical, Mechanical, and Thermal Specification	获取价格
GDQ2A8AA-CE	GIGADEVICE	近年来，随着生活娱乐、车载影音、网络通信、智慧家庭等各种消费类电子应用的蓬勃发展，利基型D	获取价格
GDQ2A8AA-CQ	GIGADEVICE	近年来，随着生活娱乐、车载影音、网络通信、智慧家庭等各种消费类电子应用的蓬勃发展，利基型D	获取价格
GDQ2A8AA-WJ	GIGADEVICE	近年来，随着生活娱乐、车载影音、网络通信、智慧家庭等各种消费类电子应用的蓬勃发展，利基型D	获取价格

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