8.0Amps Glass Passivated
Single Phase Silicon Bridge
Machamical Dimensions
+
4.2 0.2
+
21.9 0.5
+
3.85 0.25
Descriptions
+
4.4 0.2
+
1.95 0.25
+
18.6 0.3
+
20.4 0.3
1.9 R. TYP.
(2PLACES)
+
_
10.8 0.5
~
+
~
+
3.4 0.2
+
16.0 0.4
+
0.2
1.3
+
5.1 0.5
GBU
Dimensions in millimeters(1mm =0.0394")
Features
Mechanical Data
Case: Molded plastic body
Ideal for P.C. Board mounting
Terminals: Plated leads solderable per MIL-STD-202,
Method 208
High surge current capability
This series is UL listed under the Recognized
Component Index, file number E142814
The plastic material used carries Underwriters
Laboratory flammability recognition 94V-0
High temperature soldering guaranteed 265 C /10
seconds at 5 lbs (2.3kg) tension
Mounting Position:: Any
Weight: 3.8 grams (approx)
Maximum Ratings & Thermal Characteristics
Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.
For Capacitive load derate current by 20%.
GBU GBU GBU GBU GBU GBU GBU GBU
Parameter
Symbol
VRRM
VRMS
VDC
unit
800
50
801 802
100 200
804
400
806 808 810 812
600 800 1000 1200
V
Maximum repetitive peak reverse voltage
Maximum RMS bridge input voltage
Maximum DC blocking voltage
35
50
70 140
100 200
280
400
420
560 700 840
V
V
600 800 1000 1200
Maximum average forward rectified
output current at TA=100 C
8.0
IF(AV)
A
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method)
200
A
IFSM
I2 t
2sec
A
166
2.2
Rating for fusing ( t<8.3ms)
C / W
Typical thermal resistance per element(1)
ReJA
TJ,
TSTG
Operating junction and storage temperature
range
-55 to + 150
1.1
Max. instantaneous forward voltage drop
per leg at 6.0A
VF
V
Max. DC reverse current at rated Ta=25C
Max. DC reverse current at rated Ta=125C
IR
IR
5.0
uA
uA
500
Notes: Thermal resistance from Junction to Ambient on PC board mounting