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FX839P4 PDF预览

FX839P4

更新时间: 2024-01-29 18:17:53
品牌 Logo 应用领域
CMLMICRO 电信集成电路电信电路光电二极管
页数 文件大小 规格书
22页 1141K
描述
Analogue Control Interface

FX839P4 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP,Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.92
Is Samacsys:NJESD-30 代码:R-PDIP-T24
JESD-609代码:e0长度:31.37 mm
功能数量:1端子数量:24
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:5.59 mm标称供电电压:5 V
表面贴装:NO电信集成电路类型:TELECOM CIRCUIT
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15.24 mmBase Number Matches:1

FX839P4 数据手册

 浏览型号FX839P4的Datasheet PDF文件第1页浏览型号FX839P4的Datasheet PDF文件第3页浏览型号FX839P4的Datasheet PDF文件第4页浏览型号FX839P4的Datasheet PDF文件第5页浏览型号FX839P4的Datasheet PDF文件第6页浏览型号FX839P4的Datasheet PDF文件第7页 
Analogue Control Interface  
FX839  
CONTENTS  
Section  
Page  
1.0 Features .......................................................................................................... 1  
1.1 Brief Description ............................................................................................ 1  
1.2 Block Diagram................................................................................................ 3  
1.3 Signal List....................................................................................................... 4  
1.4 External Components.................................................................................... 6  
1.5 General Description....................................................................................... 7  
1.5.1 Software Description..................................................................... 8  
1.6 Application Notes......................................................................................... 15  
1.6.1 General.......................................................................................... 15  
1.7 Performance Specification.......................................................................... 16  
1.7.1 Electrical Performance ................................................................ 16  
1.7.2 Packaging ..................................................................................... 21  
Note: As this product is still in development, it is likely that a number of changes and additions will be made to  
this specification. Items marked TBD or left blank will be included in later issues. Information in this  
data sheet should not be relied upon for final product design.  
Consumer Microcircuits Limited  
2
1997  
D/839/4  

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