0.8mm Pitch Stacking Height 5~9mm Connector
FX6 Series
Stacking Height: 5~9mm
5~9mm
Mounting area 50% OFF, compared with the half pitch connector
Half pitch connector
(
)
FX2 series
FX6 series
(
)
If compared with 60 contacts
ꢀFeatures
1. Stacking Height 5~9mm
4. Automatic Mounting
The board to board stacking height can be set at every
millimeter between 5 and 9mm.
The standard packaging specification specifies the stick
package, considering the automatic mount, while the emboss
package can also correspond to the connector with less than
80 contacts. (However, the product is limited to 80 contacts.)
2. Effective Contact Length 1.7mm
Despite the low profile type connector, the connector has the
1.7mm long effective contact length and provides a margin 5. SMT Coplanarity
sufficient to contact.
The lead coplanarity on the SMT soldered area is maintained
with the high accuracy of less than 0.1mm.
3. Mating Guide
The self-alignment for mating action exhibits a high guide
level at 1mm, and makes the mating process easier by
providing the guide rib.
ꢀApplications
Note PC, business equipments such as handy terminals, and other equipment which require miniaturization or light-weight.
ꢀProduct Specifications
Rated Current 0.5A
Operating Temperature Range -55ç~+85ç Note 1. Storage Temperature Range -10ç~+60ç Note 2.
Rating
Rated Voltage 100V AC Operating Humidity Range 40%~80%
Storage Humidity Range 40%~70%
Item
Specification
Condition
1. Insulation Resistance 100Mø min
Measured at 250V DC
2. Withstand voltage
3. Contact Resistance
4. Vibration
Neither short or insulation breakdown
40mø max.
Electrical discontinuity, 1µS max.
300V AC for 1 minute
Measured at 100mA
10~55Hz and single amplitude 0.75mm in 3 directions for 10 cycles,respectively
5. Moisture Resistance Contact resistance: 50mø max.
Insulation resistance: 100mø min.
Exposed to temperature 40 2ç and humidity 90~95% for 96 hours
Contact resistance: 50mø max:
Insulation resistance: 100mø min.
6. Temperature Cycle
(-55ç: 30 minutes 15~35ç: 2~3 minutes 85ç: 30 minutes 15~35ç: 2~3minutes)5 cycles
7. Operating Life
8. Resistance to Soldering
heat
Contact resistance: 50mø max.
100 cycles
SMT type
DIP Type
Reflow: According to the recommended temperature profile
No resin area fusion to degrade performance
Soldering iron temperature: 300ç for 3 seconds
Note 1. Temperature rise included when energized
Note 2. This storage indicates a long-term storage state for the unused product before the board mounted.
The operating temperature and humidity ranges are applied to the non-energized state after the connector is installed in the
board.In addition, the operating temperature and humidity ranges can be set up to+85ç in the temporal storage state for a
transportation period.
Note 3. The above standards represent this series. Individual formalagreement should be based on the "Specification".
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