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FX30SMJ-3 PDF预览

FX30SMJ-3

更新时间: 2024-01-18 23:57:30
品牌 Logo 应用领域
三菱 - MITSUBISHI 晶体开关晶体管功率场效应晶体管局域网
页数 文件大小 规格书
4页 73K
描述
HIGH-SPEED SWITCHING USE

FX30SMJ-3 技术参数

生命周期:Transferred包装说明:FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.36外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:150 V
最大漏极电流 (Abs) (ID):30 A最大漏极电流 (ID):30 A
最大漏源导通电阻:0.111 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):150 W
最大脉冲漏极电流 (IDM):120 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FX30SMJ-3 数据手册

 浏览型号FX30SMJ-3的Datasheet PDF文件第2页浏览型号FX30SMJ-3的Datasheet PDF文件第3页浏览型号FX30SMJ-3的Datasheet PDF文件第4页 
MITSUBISHI Pch POWER MOSFET  
FX30SMJ-3  
HIGH-SPEED SWITCHING USE  
FX30SMJ-3  
OUTLINE DRAWING  
Dimensions in mm  
4.5  
1.5  
15.9 max  
4
φ 3.2  
2
4.4  
2.8  
G
1.0  
1
2
3
5.45  
5.45  
0.6  
4
3
4V DRIVE  
1
2
3
4
GATE  
DRAIN  
SOURCE  
DRAIN  
VDSS ............................................................. –150V  
rDS (ON) (MAX) .............................................. 100m  
1
ID .................................................................... –30A  
Integrated Fast Recovery Diode (TYP.) .........100ns  
2
4
T0-3P  
APPLICATION  
Motor control, Lamp control, Solenoid control  
DC-DC converter, etc.  
MAXIMUM RATINGS (Tc = 25°C)  
Symbol  
VDSS  
VGSS  
ID  
Parameter  
Drain-source voltage  
Gate-source voltage  
Drain current  
Conditions  
Ratings  
Unit  
V
VGS = 0V  
VDS = 0V  
–150  
±20  
V
–30  
A
IDM  
IDA  
Drain current (Pulsed)  
–120  
A
Avalanche drain current (Pulsed) L = 30µH  
Source current  
–30  
A
IS  
–30  
A
ISM  
Source current (Pulsed)  
Maximum power dissipation  
Channel temperature  
–120  
A
PD  
150  
W
°C  
°C  
g
Tch  
–55 ~ +150  
–55 ~ +150  
4.8  
Tstg  
Storage temperature  
Weight  
Typical value  
Jan.1999  

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