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Datasheet > FX10B-140S/14-SV(21)
FX10B-140S/14-SV(21) PDF预览

FX10B-140S/14-SV(21)

更新时间： 2024-10-14 21:16:59
品牌 Logo 应用领域
广濑 - HRS PC连接器
页数 文件大小 规格书
20页 628K
描述
Board Stacking Connector, 154 Contact(s), 2 Row(s), Female, Straight, 0.02 inch Pitch, Surface Mount Terminal, Beige Insulator, Receptacle

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FX10B-140S/14-SV(21) 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8536.69.40.40风险等级：5.81
其他特性：HIGH DENSITY, 14 GROUND CONTACTS ALSO AVAILABLE主体宽度：0.287 inch
主体深度：0.126 inch主体长度：1.933 inch
主体/外壳类型：RECEPTACLE连接器类型：BOARD STACKING CONNECTOR
联系完成配合：GOLD联系完成终止：GOLD
触点性别：FEMALE触点材料：PHOSPHOR BRONZE
触点模式：RECTANGULAR触点电阻：60 m Ω
触点样式：BELLOWED TYPEDIN 符合性：NO
介电耐压：150VAC V耐用性：50 Cycles
滤波功能：NOIEC 符合性：NO
绝缘电阻：100000000 Ω绝缘体颜色：BEIGE
绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)MIL 符合性：NO
插接触点节距：0.02 inch插接信息：MULTIPLE MATING PARTS AVAILABLE
混合触点：NO安装方式：STRAIGHT
安装类型：BOARD连接器数：ONE
PCB行数：2装载的行数：2
最高工作温度：85 °C最低工作温度：-55 °C
选件：GENERAL PURPOSEPCB接触模式：RECTANGULAR
PCB触点行间距：6.096 mm电镀厚度：4u inch
极化密钥：POLARIZED HOUSING额定电流（信号）：0.3 A
参考标准：UL可靠性：COMMERCIAL
子类别：Headers and Edge Type Connectors端子长度：
端子节距：0.5 mm端接类型：SURFACE MOUNT
触点总数：154UL 易燃性代码：94V-0
Base Number Matches：1

FX10B-140S/14-SV(21) 数据手册

 浏览型号FX10B-140S/14-SV(21)的Datasheet PDF文件第2页浏览型号FX10B-140S/14-SV(21)的Datasheet PDF文件第3页浏览型号FX10B-140S/14-SV(21)的Datasheet PDF文件第4页浏览型号FX10B-140S/14-SV(21)的Datasheet PDF文件第5页浏览型号FX10B-140S/14-SV(21)的Datasheet PDF文件第6页浏览型号FX10B-140S/14-SV(21)的Datasheet PDF文件第7页 
10+Gbps 0.5mm pitch Stacking Connectors  
FX10 Series Electrical Interface for the OIF 100G Long-Haul DWDM Transmission Module (MSA-100GLH)  
●Mechanical Features  
● 0.5mm Pitch  
● Stacking Height : 4 ~ 8mm  
● Number of Contacts  
With ground plate type : 80 / 100 / 120 / 140  
Without ground plate type : 96 / 120 / 144 / 168  
● Improved Transmission Efficiency  
Between Boards  
Transmission characteristics have been improved through a  
design that fixes ground plates to both sides of the header  
and receptacle.  
●With GND Plate Type  
● 10 Signal:1 Ground Arrangement  
Signal and ground are arranged in a ratio of 10:1 with the  
ground plate SMT connected to the board. The ground  
stability achieved serves to reduce noise.  
Ground  
plate  
● Metal Fittings for Added Solder Weld  
Signal contact  
Strength  
Metal fittings provide greater adhesion to the board,  
protecting against peeling. The unique connector design  
provides a connection between the fitting and the ground  
plate for a stronger ground.  
Housing  
Metal fitting  
Ground plate and metal  
fitting make contact  
● Suited to High-Density Applications  
The signal contact pitch of 0.5 mm produces a smaller  
connector utilizing less board area for mounting.  
●Cut Section  
● High contact reliability  
Effective mating length is 1.1 mm for signal contacts.  
● Optional Ground Plate  
An alternate style without the ground plate is available. The  
space provided by the ground plate removal has been filled  
with additional signal contacts.  
●Signal Integrity Features  
115  
110  
105  
100  
95  
60  
50  
40  
30  
20  
10  
0
●Insertion-Loss-to-Crosstalk-Ratio(ICR)  
The insertion-loss-to-crosstalk-ratio (ICR) with five-  
aggressor differential FEXT meets the extrapolated  
+
IEEE 802.3ap specification for 10 Gbps.  
●Differential Impedance  
The differential impedance is within 100 +/- 10 ohms  
at 30ps rise time (20% to 80%).  
ICR  
90  
85  
ICR spec  
S(3,3)  
800 1000  
0
2
4
6
8
10  
0
200  
400  
Time (ps)  
600  
Frequency (GHz)  
●Stack Height  
●With ground plate  
Headers  
FX10#-*P/*-SV FX10#–*P/*–SV1  
Receptacles  
FX10#-*S/*-SV  
4mm  
5mm  
●Without ground plate  
Headers  
FX10#-*P-SV FX10–*P–SV1 FX10#-168P-SV2 FX10#-168P-SV3 FX10#-168P-SV4  
Receptacles  
(H):Reference dimension  
4mm  
5mm  
6mm  
7mm  
8mm  
FX10#-*S-SV  
2011.01w  
1
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