Datasheet > FSRV05-4-3PF

FSRV05-4-3PF

更新时间： 2024-11-24 01:19:43

品牌	Logo	应用领域
未来芯 - FUTUREWAFER		/
页数	文件大小	规格书
5页	972K
描述
Ultra Low Capacitance ESD array

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中文翻译

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数据手册

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FSRV05-4-3PF 数据手册

FSRV05-4

Ultra Low Capacitance ESD array

Applications

● Personnal Digital Assistance

● Wireless System

● DVI

● High Speed Data Line

● Ethernet

● USB 2.0 Power and Data line Protection

SOT23-6L

Feature

● With TVS Diode

● ESD Protection:Level 4

● Low clamping voltage

● 350 Watts peak pulse power per line(tp=8/20uS)

● Ultra low capacitance:3pf max.(any I/O to GND.)

● Protection 4 lines I/O port

Mechanical Characteristics

● Molded JEDEC SOT23-6L package

● Packing: Tape and Reel

IEC Compatibility

● EN61000-4

● 61000-4-2(ESD):LeveL 4,Contact:±8kv,Air::±15kv

● 61000-4-4(EFT):40A-5/50ns

● 61000-4-5(Surge):12A,8/20us

● Flammability rating UL 94V-0

● Halogen Free

Device Characteristics

Maximum Ratings@25 unless otherwise specified

Parameter

Peak pulse power (tp=8/20us) see fig 1.

Operating Temperature

Symbol

PPP

Value

350

Units

Watts

°C

-55~150

Storage Temperature

TSTG

IPP

°C

Peak Pulse Current(tp=8/20us)

>8(Contact)

Electrostatic Discharge

VESD

>15(Air)

⑥

⑤

Identification

1,3,4,6

Input lines

VCC IN

④

①

②

③

Ground

Futurewafer Technology Co., Ltd

E1606F6A-STD-FW-002

12 3 4 5

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