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FSA3230 PDF预览

FSA3230

更新时间: 2024-11-13 12:23:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
3页 445K
描述
High-Speed USB2.0 / Mobile High- Definition Link (MHL™) with Negative Swing Audio

FSA3230 数据手册

 浏览型号FSA3230的Datasheet PDF文件第2页浏览型号FSA3230的Datasheet PDF文件第3页 
November 2012  
FSA3230 — High-Speed USB2.0 / Mobile High-  
Definition Link (MHL™) with Negative Swing Audio  
Features  
Description  
The FSA3230 is a bi-directional, low-power, high-speed,  
3:1, USB2.0, MHL™ and audio switch. Configured as a  
double-pole, triple-throw (DP3T) switch, it is optimized  
for switching between high- or full-speed USB, Mobile  
High-Definition Link sources (per MHL Rev. 2.0  
specification) and negative swing capable audio. A  
Single-Pole, Double-Throw (SPDT) switch is provided  
for ID. This ID switch provides path to support On-The-  
Go (OTG) communication for the USB Path OR CBUS  
for the MHL Path.  
.
Low On Capacitance: 6 pF / 6 pF MHL / USB  
(Typical)  
.
.
.
.
.
.
.
Low Power Consumption: 30 μA Maximum  
Supports MHL Rev. 2.0  
MHL Data Rate: 4.0 Gbps  
Audio Swing: -1.5 V to +1.5 V (Typical)  
VBUS Powers Device with No VCC  
Packaged in 16-Lead UMLP (1.8 x 2.6 mm)  
The FSA3230 contains special circuitry on the switch  
I/O pins, for applications where the VCC supply is  
powered off (VCC=0), that allows the device to withstand  
an over-voltage condition. This switch is designed to  
minimize current consumption even when the control  
voltage applied to the control pins is lower than the  
supply voltage (VCC). This is especially valuable in  
mobile applications, such as cell phones; allowing direct  
interface with the general-purpose I/Os of the baseband  
processor. Other applications include switching and  
connector sharing in portable cell phones, digital  
cameras, and notebook computers.  
Over-Voltage Tolerance (OVT) on all USB Ports,  
Up to 5.25 V without External Components  
Applications  
.
Cell Phones and Digital Cameras  
Ordering Information  
Part Number Top Mark Operating Temperature Range  
Package  
16-Lead, Ultrathin Molded Leadless Package  
(UMLP), 1.8 x 2.6 mm  
FSA3230UMX  
LK  
-40 to +85°C  
© 2012 Fairchild Semiconductor Corporation  
FSA3230 • Rev. 1.0.1  
www.fairchildsemi.com  

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