FS61857-01
1:10 HSTL Zero-Delay Clock Buffer IC
AMERICAN MICROSYSTEMS, INC.
Advance Information
November 2000
4.0 Electrical Specifications
Table 3: Absolute Maximum Ratings
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at
these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance,
functionality, and reliability.
PARAMETER
SYMBOL
MIN.
MAX.
UNITS
Supply Voltage, dc, Clock Buffers (GND = ground)
Supply Voltage, dc, Core
Input Voltage, dc
AVDD
VDD
VI
VO
IIK
IOK
TS
TA
GND-0.5
GND-0.5
GND-0.5
GND-0.5
-50
4
4
V
V
V
VDD+0.5
VDD+0.5
50
Output Voltage, dc
V
Input Clamp Current, dc (VI < 0 or VI > VDD
)
mA
mA
°C
°C
°C
°C
kV
Output Clamp Current, dc (VI < 0 or VI > VDD
)
-50
-65
-55
50
Storage Temperature Range (non-condensing)
Ambient Temperature Range, Under Bias
Junction Temperature
Lead Temperature (soldering, 10s)
Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7)
150
125
125
260
2
TJ
CAUTION: ELECTROSTATIC SENSITIVE DEVICE
Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy
electrostatic discharge.
Table 4: Operating Conditions
PARAMETER
SYMBOL
CONDITIONS/DESCRIPTION
MIN.
TYP.
MAX.
UNITS
AVDD
VDD
TA
Core
Outputs
2.3
2.3
0
2.5
2.5
2.7
2.7
70
Supply Voltage
V
Ambient Operating Temperature Range
°C
Frequency range over which PLL
acquires lock
Frequency range where all timing
parameter specification are met
60
90
170
170
Input Frequency (CKP / CKN)
fCLK
MHz
Input Duty Cycle
Input Rise/Fall Time
Spread-Spectrum Modulation Frequency
Spread-Spectrum Modulation Index
Output Load Capacitance
CKP / CKN
CKP / CKN (over 20% to 80%)
40
0.375
30
60
1.5
50
-0.5
15
%
ns
MHz
%
tr, tf
fm
δm
0
CL
pF
ISO9001
QS9000
3