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FDB3652_F085 PDF预览

FDB3652_F085

更新时间: 2024-02-04 14:46:26
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关晶体管
页数 文件大小 规格书
11页 412K
描述
Power Field-Effect Transistor, 9A I(D), 100V, 0.016ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, ROHS COMPLIANT PACKAGE-3

FDB3652_F085 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:14 weeks风险等级:5.17
雪崩能效等级(Eas):182 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):61 A最大漏极电流 (ID):9 A
最大漏源导通电阻:0.016 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):150 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDB3652_F085 数据手册

 浏览型号FDB3652_F085的Datasheet PDF文件第2页浏览型号FDB3652_F085的Datasheet PDF文件第3页浏览型号FDB3652_F085的Datasheet PDF文件第4页浏览型号FDB3652_F085的Datasheet PDF文件第5页浏览型号FDB3652_F085的Datasheet PDF文件第6页浏览型号FDB3652_F085的Datasheet PDF文件第7页 
October 2008  
FDB3652_F085  
N-Channel PowerTrench® MOSFET  
100V, 61A, 16m  
Features  
Applications  
rDS(ON) = 14m(Typ.), VGS = 10V, ID = 61A  
Qg(tot) = 41nC (Typ.), VGS = 10V  
Low Miller Charge  
DC/DC Converters and Off-line UPS  
Distributed Power Architectures and VRMs  
Primary Switch for 24V and 48V Systems  
High Voltage Synchronous Rectifier  
Direct Injection / Diesel Injection Systems  
42V Automotive Load Control  
Low QRR Body Diode  
UIS Capability (Single Pulse and Repetitive Pulse)  
Qualified to AEC Q101  
Electronic Valve Train Systems  
RoHS Compliant  
Formerly developmental type 82769  
D
DRAIN  
(FLANGE)  
GATE  
G
SOURCE  
TO-263AB  
S
FDB SERIES  
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDSS  
VGS  
Parameter  
Ratings  
100  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current  
V
V
±20  
Continuous (TC = 25oC, VGS = 10V)  
Continuous (TC = 100oC, VGS = 10V)  
Continuous (Tamb = 25oC, VGS = 10V) with RθJA = 43oC/W)  
Pulsed  
61  
A
ID  
43  
9
A
A
Figure 4  
182  
A
EAS  
Single Pulse Avalanche Energy (Note 1)  
Power dissipation  
mJ  
150  
W
PD  
Derate above 25oC  
1.0  
W/oC  
oC  
TJ, TSTG  
Operating and Storage Temperature  
-55 to 175  
Thermal Characteristics  
RθJC  
RθJA  
RθJA  
Thermal Resistance Junction to Case TO-263  
Thermal Resistance Junction to Ambient TO-263  
Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad area  
1.0  
62  
43  
oC/W  
oC/W  
oC/W  
(Note 2)  
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a  
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/  
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.  
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems  
certification.  
©2008 Fairchild Semiconductor Corporation  
FDB3652_F085 Rev. A1  
1

FDB3652_F085 替代型号

型号 品牌 替代类型 描述 数据表
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