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FCPF400N60 PDF预览

FCPF400N60

更新时间: 2024-11-23 11:59:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
9页 270K
描述
600V N-Channel MOSFET

FCPF400N60 数据手册

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March 2012  
SuperFET® II  
FCPF400N60  
600V N-Channel MOSFET  
Features  
Description  
650V @TJ = 150°C  
SuperFET®II is, Fairchild’s proprietary, new generation of high  
voltage MOSFET family that is utilizing an advanced charge bal-  
ance mechanism for outstanding low on-resistance and lower  
gate charge performance.  
Max. RDS(on) = 400mΩ  
Ultra low gate charge (typ. Qg = 28nC)  
Low effective output capacitance (typ. Coss.eff = 90pF)  
100% avalanche tested  
This advanced technology has been tailored to minimize con-  
duction loss, provide superior switching performance, and with-  
stand extreme dv/dt rate and higher avalanche energy.  
Consequently, SuperFET®II is very suitable for various AC/DC  
power conversion in switching mode operation for system minia-  
turization and higher efficiency.  
D
G
TO-220F  
G D  
S
S
Absolute Maximum Ratings TC = 25oC unless otherwise noted  
Symbol  
VDSS  
Parameter  
FCPF400N60  
600  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
V
-DC  
±20  
VGSS  
ID  
V
A
-AC  
(f>1HZ)  
±30  
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- Pulsed  
10*  
Drain Current  
6.3*  
IDM  
EAS  
IAR  
Drain Current  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
30*  
A
mJ  
A
Single Pulsed Avalanche Energy  
Avalanche Current  
211.6  
2.3  
EAR  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
MOSFET dv/dt  
1.06  
mJ  
20  
dv/dt  
PD  
V/ns  
100  
(TC = 25oC)  
- Derate above 25oC  
31  
W
W/oC  
oC  
Power Dissipation  
0.25  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
Units  
FCPF400N60  
RθJC  
RθCS  
RθJA  
4
Thermal Resistance, Case to Heat Sink (Typical)  
Thermal Resistance, Junction to Ambient  
0.5  
oC/W  
62.5  
©2012 Fairchild Semiconductor Corporation  
FCPF400N60 Rev. C2  
1
www.fairchildsemi.com  

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