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FCP11N60 PDF预览

FCP11N60

更新时间: 2024-11-22 22:31:47
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
10页 811K
描述
SuperFET

FCP11N60 数据手册

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TM  
SuperFET  
FCP11N60/FCPF11N60  
General Description  
Features  
TM  
SuperFET is a new generation of high voltage MOSFETs  
650V @T = 150°C  
Typ. Rds(on)=0.32Ω  
Ultra low gate charge (typ. Qg=40nC)  
Low effective output capacitance (typ. Coss.eff=95pF)  
100% avalanche tested  
j
from Fairchild with outstanding low on-resistance and low  
gate charge performance, a result of proprietary technology  
utilizing advanced charge balance mechanisms.  
This advanced technology has been tailored to minimize  
conduction loss, provide superior switching performance,  
and withstand extreme dv/dt rate and higher avalanche  
energy. Consequently, SuperFET is very suitable for  
various AC/DC power conversion in switching mode  
operation for system miniaturization and higher efficiency.  
D
!
G!  
TO-220  
FCP Series  
TO-220F  
FCPF Series  
G D  
S
G
D S  
!
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FCP11N60  
FCPF11N60  
Units  
A
I
- Continuous (T = 25°C)  
Drain Current  
11  
7
11*  
7*  
D
C
- Continuous (T = 100°C)  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
33  
33*  
A
DM  
V
E
I
Gate-Source Voltage  
± 30  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
340  
11  
mJ  
A
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
12.5  
4.5  
mJ  
V/ns  
W
AR  
dv/dt  
P
Power Dissipation (T = 25°C)  
125  
1.0  
36  
D
C
- Derate above 25°C  
Operating and Storage Temperature Range  
0.29  
W/°C  
°C  
T , T  
-55 to +150  
J
STG  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
* Drain current limited by maximum junction termperature  
Thermal Characteristics  
Symbol  
Parameter  
FCP11N60  
1.0  
FCPF11N60  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink  
3.5  
--  
θJC  
0.5  
θCS  
θJA  
Thermal Resistance, Junction-to-Ambient  
62.5  
62.5  
©2004 Fairchild Semiconductor Corporation  
Rev. B, March 2004  

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