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FCP11N60N PDF预览

FCP11N60N

更新时间: 2024-11-23 06:58:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
10页 918K
描述
N-Channel MOSFET 600V, 10.8A, 0.299Ω

FCP11N60N 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-220
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.69
Is Samacsys:N雪崩能效等级(Eas):201.7 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (Abs) (ID):10.8 A最大漏极电流 (ID):10.8 A
最大漏源导通电阻:0.299 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):94 W最大脉冲漏极电流 (IDM):32.4 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FCP11N60N 数据手册

 浏览型号FCP11N60N的Datasheet PDF文件第2页浏览型号FCP11N60N的Datasheet PDF文件第3页浏览型号FCP11N60N的Datasheet PDF文件第4页浏览型号FCP11N60N的Datasheet PDF文件第5页浏览型号FCP11N60N的Datasheet PDF文件第6页浏览型号FCP11N60N的Datasheet PDF文件第7页 
August 2009  
TM  
SupreMOS  
FCP11N60N / FCPF11N60NT  
tm  
N-Channel MOSFET  
600V, 10.8A, 0.299Ω  
Features  
Description  
RDS(on) = 0.255Ω ( Typ.)@ VGS = 10V, ID = 5.4A  
Ultra Low Gate Charge ( Typ. Qg = 27.4nC)  
Low Effective Output Capacitance  
100% Avalanche Tested  
The SupreMOS MOSFET, Fairchild’s next generation of high  
voltage super-junction MOSFETs, employs a deep trench filling  
process that differentiates it from preceding multi-epi based  
technologies. By utilizing this advanced technology and precise  
process control, SupreMOS provides world class Rsp, superior  
switching performance and ruggedness.  
This SupreMOS MOSFET fits the industry’s AC-DC SMPS  
requirements for PFC, server/telecom power, FPD TV power,  
ATX power, and industrial power applications.  
RoHS Compliant  
D
G
TO-220  
FCP Series  
TO-220F  
FCPF Series  
S
G D S  
G D S  
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*  
Symbol  
VDSS  
VGSS  
Parameter  
FCP11N60N FCPF11N60NT Units  
Drain to Source Voltage  
Gate to Source Voltage  
600  
±30  
V
V
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- Pulsed  
10.8  
6.8  
10.8*  
6.8*  
ID  
Drain Current  
A
IDM  
EAS  
IAR  
Drain Current  
(Note 1)  
(Note 2)  
32.4  
32.4*  
A
mJ  
Single Pulsed Avalanche Energy  
Avalanche Current  
201.7  
3.7  
A
EAR  
Repetitive Avalanche Energy  
MOSFET dv/dt Ruggedness  
Peak Diode Recovery dv/dt  
0.94  
100  
20  
mJ  
V/ns  
V/ns  
W
W/oC  
oC  
dv/dt  
PD  
(Note 3)  
(TC = 25oC)  
- Derate above 25oC  
94.0  
0.75  
32.1  
0.26  
Power Dissipation  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
FCP11N60N FCPF11N60NT Units  
RθJC  
RθCS  
RθJA  
1.33  
0.5  
3.9  
0.5  
Thermal Resistance, Case to Heat Sink (Typical)  
Thermal Resistance, Junction to Ambient  
oC/W  
62.5  
62.5  
©2009 Fairchild Semiconductor Corporation  
FCP11N60N / FCPF11N60NT Rev. A  
1
www.fairchildsemi.com  

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