Datasheet > ETCSP

ETCSP

更新时间： 2024-09-17 04:17:47

品牌	Logo	应用领域
AMKOR		栅
页数	文件大小	规格书
2页	148K
描述
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.

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ETCSP 数据手册

LAMINATE

data sheet

etCSP^®

• Up to 176 ball count

• 7-12 mm body size

Features:

• Thinnest CSP available at 0.5 mm max mounted height

• JEDEC Level 1 Reliability to 260 °C reflow temperature

• Conventional process flow with proven wirebond technology

• Standardized footprints at 0.5 mm pitch

• Package stacking potential of tested packages

• Two stacked die potential

12 x 12 mm body; 176 I/O; Typical 39 °C/W

Thermal Performance:

Amkor’s initial etCSP packages are offered for low power

etCSP Package:

applications. Higher thermal performance can be achieved by

adding a heat spreader or heat sink to the die's exposed

backside. In addition, future die-up configurations will provide

a direct heat dissipation path into the product motherboard

through the die backside.

Amkor's etCSP package is the first ball grid array

capable of an extremely thin 0.5 mm maximum

mounted height. This package can squeeze into

applications requiring a thin form factor. The

etCSP package is constructed using conventional

Min

Max

IC processing including standard wire bonding,

molding and substrate infrastructure. The resulting

package consists of one or two peripheral rows of

0.3 mm diameter solder balls to allow common

SMT processing.

Electrical:

Inductance (nH)

Capacitance (pF)

Resistance (mOhms)

0.735

0.176

47.9

1.546

0.319

89.83

Package Dimensions:

7 x 7 mm body; 89 I/O; 0.3 mm ball diameter; 100 MHz

There are many advantages as a direct result of the

unique etCSP design. One key advantage is the

0.5 mm mounted height of the package, the result of

solder ball diameter and thin core laminate substrate.

Every other aspect of the package, die, wires and

moldcap are within the dimensions of the substrate

Package Level*:

• Moisture sensitivity JEDEC Level 1 @ 260 °C

• Temp Cycle

• Temp/Humidity

• High Temp Storage 150 °C, 1000 hrs

• PCT/HAST

*Data for 12 x 12 mm body; 176 I/O; 7.62 mm DC die,

0.15 mm thick

Board Level:

Reliability:

-55° C/+125 °C, 1000 cycles

85 °C/ 85% RH, 1000 hrs

and solderballs. Another direct result of the etCSP

design is the superior moisture resistance. Since

die attach materials are not used to mount the

die, there is reduced capability to trap moisture.

Therefore, popcorn induced delamination is reduced.

130 °C, 85% RH, 96 hrs

• Thermal cycle

-55 °C / 125 °C 2 cycles / hour,

1000 cycles

The etCSP package can also be designed with the

capability of stacking completely tested packages,

i.e., packaged memory, into a single footprint on the

motherboard. In this manner, two stacked etCSP™

packages can be tested before mounting and the

combined height is less than 1.0 mm.

• First failure 1100 cycles

• Lead free solder

Applications:

Amkor's etCSP design makes this package type ideal for PCMCIA card applications, mini disk

drives, thin wireless handsets, Flash or EEPROM memory and other portable products where vertical

height is limited. Because of the unique design of the etCSP package, stacking is easily achieved

with proper substrate designs. This creates an opportunity to multiply memory capacity without

increasing board area.

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

^{TO VIEW THE MOST CURRENT PRODUCT INFORMATION}.

DS578F

Rev Date: 07’03

www.amkor.com

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