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ESD8472

更新时间: 2024-10-01 01:15:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 143K
描述
Ultra-Low Capacitance ESD Protection Diodes

ESD8472 数据手册

 浏览型号ESD8472的Datasheet PDF文件第2页浏览型号ESD8472的Datasheet PDF文件第3页浏览型号ESD8472的Datasheet PDF文件第4页浏览型号ESD8472的Datasheet PDF文件第5页 
ESD8472  
Ultra-Low Capacitance ESD  
Protection Diodes  
Micro−Packaged Diodes for ESD Protection  
The ESD8472 is designed to protect voltage sensitive components  
that require ultra-low capacitance from ESD and transient voltage  
events. Excellent clamping capability, low capacitance, high  
breakdown voltage, high linearity, low leakage, and fast response time  
make these parts ideal for ESD protection on designs where board  
space is at a premium. It has industry leading capacitance linearity  
over voltage making it ideal for RF applications. This capacitance  
linearity combined with the extremely small package and low  
insertion loss makes this part well suited for use in antenna line  
applications for wireless handsets and terminals.  
www.onsemi.com  
MARKING  
DIAGRAM  
Features  
PIN 1  
Industry Leading Capacitance Linearity Over Voltage  
Ultra−Low Capacitance: 0.2 pF  
Insertion Loss: 0.030 dBm  
X3DFN2  
CASE 152AF  
4 M  
0201DNS Package: 0.60 mm x 0.30 mm  
Stand−off Voltage: 5.3 V  
4
= Specific Device Code  
M = Date Code  
Low Leakage: < 1 nA  
Low Dynamic Resistance: < 1 W  
1000 ESD IEC61000−4−2 Strikes 8 kV Contact / Air Discharged  
ORDERING INFORMATION  
Device  
ESD8472MUT5G  
Package  
Shipping  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
X3DFN2  
(Pb−Free)  
10000 / Tape &  
Reel  
SZESD8472MUT5G X3DFN2  
(Pb−Free)  
15000 / Tape &  
Reel  
These Devices are Pb−Free, Halogen Free and are RoHS Compliant  
Typical Applications  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
RF Signal ESD Protection  
RF Switching, PA, and Antenna ESD Protection  
Near Field Communications  
USB 2.0, USB 3.0  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Rating  
Symbol  
Value  
Unit  
IEC 61000−4−2 Level 4 (Contact) (Note 1)  
IEC 61000−4−2 Level 4 (Air) (Note 1)  
ESD  
20  
20  
kV  
Maximum Peak Pulse Current  
I
PP  
3.0  
A
IEC 61000−4−5 8/20 ms (Lightning) (Note 2)  
Total Power Dissipation (Note 3) @ T = 25°C  
°P °  
300  
400  
mW  
°C/W  
A
D
Thermal Resistance, Junction−to−Ambient  
R
q
JA  
Junction and Storage Temperature Range  
T , T  
−55 to  
+150  
°C  
J
stg  
Lead Solder Temperature − Maximum  
(10 Second Duration)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Non−repetitive current pulse at T = 25°C, per IEC61000−4−2 waveform.  
A
2. Non−repetitive current pulse at T = 25°C, per IEC61000−4−5 waveform.  
A
3. Mounted with recommended minimum pad size, DC board FR−4  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
June, 2016 − Rev. 9  
ESD8472/D  
 

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