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ESD8504G_17 PDF预览

ESD8504G_17

更新时间: 2024-01-02 04:32:03
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
9页 244K
描述
ESD Protection Diode

ESD8504G_17 数据手册

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ESD8504G  
ESD Protection Diode  
Low Capacitance Array for High Speed  
Data Lines  
The ESD8504G is designed to protect high speed data lines from  
ESD. Ultra−low capacitance and low ESD clamping voltage make this  
device an ideal solution for protecting voltage sensitive high speed  
data lines. The flow−through style package allows for easy PCB layout  
and matched trace lengths necessary to maintain consistent impedance  
between high speed differential lines such as USB 3.0/3.1.  
www.onsemi.com  
MARKING  
DIAGRAM  
UDFN10  
CASE 517BB  
4GMG  
Features  
G
Low Capacitance (0.5 pF Max, I/O to GND)  
4G  
M
G
= Specific Device Code  
= Date Code  
= Pb−Free Package  
Protection for the Following IEC Standards:  
IEC 61000−4−2 (Level 4)  
Low ESD Clamping Voltage  
(Note: Microdot may be in either location)  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
PIN CONFIGURATION  
AND SCHEMATIC  
Typical Applications  
USB 3.0/3.1  
eSATA  
N/C N/C GND N/C N/C  
10  
9
8
7
6
DisplayPort  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
1
2
3
4
5
J
I/O I/O GND I/O I/O  
Rating  
Symbol  
Value  
55 to +125  
55 to +150  
260  
Unit  
°C  
Operating Junction Temperature Range  
Storage Temperature Range  
T
J
I/O  
I/O  
I/O  
I/O  
Pin 1  
Pin 2 Pin 4  
Pin 5  
T
stg  
°C  
Lead Solder Temperature −  
Maximum (10 Seconds)  
T
L
°C  
IEC 61000−4−2 Contact (ESD)  
IEC 61000−4−2 Air (ESD)  
ESD  
ESD  
25  
25  
kV  
kV  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Pins 3, 8  
Note: Common GND − Only Minimum of 1 GND connection required  
=
ORDERING INFORMATION  
Device  
Package  
Shipping  
ESD8504GMUTAG UDFN10  
(Pb−Free)  
3000 / Tape &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
See Application Note AND8308/D for further description of  
survivability specs.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
January, 2017 − Rev. 1  
ESD8504G/D  

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