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ESD8106 PDF预览

ESD8106

更新时间: 2024-10-04 01:15:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 313K
描述
Transient Voltage Suppressors

ESD8106 数据手册

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ESD8106  
Transient Voltage  
Suppressors  
Low Capacitance ESD Protection for  
USB 3.0 Interface  
http://onsemi.com  
MARKING  
The ESD8106 transient voltage suppressor is specifically designed  
to protect USB 3.0 interfaces by integrating two Superspeed pairs, D+  
and Dlines into a single protection product. Ultralow capacitance  
and low ESD clamping voltage make this device an ideal solution for  
protecting voltage sensitive high speed data lines. The flowthrough  
style package allows for easy PCB layout and matched trace lengths  
necessary to maintain consistent impedance between high speed  
differential lines.  
DIAGRAM  
14  
1
6DM  
G
UDFN14  
CASE 517CQ  
6D = Specific Device Code  
M
= Date Code  
G
= PbFree Package  
Features  
Low Capacitance (0.35 pF Max, I/O to GND)  
Protection for the Following IEC Standards:  
IEC 6100042 Level 4  
PIN CONFIGURATION  
UL Flammability Rating of 94 V0  
I/O  
14  
I/O  
13  
I/O  
12  
I/O GND I/O  
I/O  
8
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
11  
10  
9
Compliant  
Typical Applications  
4
5
USB 3.0  
1
2
3
6
7
*N/C N/C N/C N/C GND N/C N/C  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
*Pins 17 should be connected to opposite pin  
with PCB trace in order to maintain a flowthru  
routing scheme.  
Rating  
Symbol  
Value  
55 to +125  
55 to +150  
260  
Unit  
°C  
Operating Junction Temperature Range  
Storage Temperature Range  
T
J
T
stg  
°C  
ORDERING INFORMATION  
Lead Solder Temperature −  
T
L
°C  
Maximum (10 Seconds)  
Device  
Package  
Shipping  
IEC 6100042 Contact (ESD)  
IEC 6100042 Air (ESD)  
ESD  
ESD  
15  
15  
kV  
kV  
ESD8106MUTAG UDFN14 3000 / Tape & Reel  
(PbFree)  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
See Application Note AND8308/D for further description of  
survivability specs.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
October, 2013 Rev. 1  
ESD8106/D  

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