ESD7382MUT5G
ESD Protection Diodes
Micro−Packaged Diodes for ESD Protection
The ESD7382 is designed to protect voltage sensitive components
that require ultra−low capacitance from ESD and transient voltage
events. Excellent clamping capability, low capacitance, low leakage,
and fast response time, make these parts ideal for ESD protection on
designs where board space is at a premium. Because of its low
capacitance, it is suited for use in high frequency designs such as
USB 2.0 high speed and antenna line applications.
www.onsemi.com
1
2
Cathode
Anode
Features
• Ultra−Low Capacitance: 0.37 pF
• Low Clamping Voltage
MARKING
DIAGRAM
PIN 1
• Small Body Outline Dimensions: 0.60 mm x 0.30 mm
• Low Body Height: 0.3 mm
• Stand−off Voltage: 5.0 V
X3DFN2
CASE 152AF
M
• Low Leakage
• Insertion Loss: 0.030 dBm
• Response Time is < 1 ns
2
= Specific Device Code
(Rotated 270°)
M
= Date Code
• Low Dynamic Resistance < 1 W
• IEC61000−4−2 Level 4 ESD Protection
X2DFN2
CASE 714AB
(In Development)
XX M
G
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
XX = Specific Device Code
Typical Applications
M
= Date Code
• RF Signal ESD Protection
• RF Switching, PA, and Antenna ESD Protection
• Near Field Communications
G
= Pb−Free Package
ORDERING INFORMATION
MAXIMUM RATINGS
†
Device
Package
Shipping
Rating
IEC 61000−4−2 (ESD)
Symbol
Value
Unit
ESD7382MUT5G
X3DFN2
(Pb−Free)
10,000 / Tape &
Reel
Contact
Air
20
20
kV
ESD7382N2T5G
(In Development)
X2DFN2
(Pb−Free)
10,000 / Tape &
Reel
Total Power Dissipation on FR−5 Board
°P °
250
mW
D
(Note 1) @ T = 25°C
A
Thermal Resistance, Junction−to−Ambient
R
400
−40 to +125
260
°C/W
°C
q
JA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Junction and Storage Temperature Range T , T
J
stg
Lead Solder Temperature − Maximum
(10 Second Duration)
T
L
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
This document contains information on some products that are still under development.
ON Semiconductor reserves the right to change or discontinue these products without
notice.
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
January, 2017 − Rev. 2
ESD7382/D