R
UMW
ESD5Zxx
Descriptions
The ESD5Zxx Series is designed to protect voltage
sensitive components from ESD and transient voltage events.
Excellent clamping capability, low leakage, and fast response time,
make these parts ideal for ESD protection on designs where board
space is at a premium. Because of its small size, it is suited for
use in cellular phones, portable devices, digital cameras, power
supplies and many other portable applications.
1
2
Cathode
Anode
MARKING DIAGRAM
Specification Features:
• Low Clamping Voltage
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
• Small Body Outline Dimensions:
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
• Low Body Height: 0.028″ (0.7 mm)
• Stand−off Voltage: 2.5 V − 12 V
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
°
QUALIFIED MAX REFLOW TEMPERATURE: 260 C
• Peak Power up to 240 Watts @ 8 x 20 ms Pulse
• Low Leakage
• Response Time is Typically < 1 ns
Device Meets MSL 1 Requirements
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• IEC61000−4−2 Level 4 ESD Protection
• IEC61000−4−4 Level 4 EFT Protection
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
kV
30
30
IEC 61000−4−4 (EFT)
40
A
ESD Voltage
Per Human Body Model
Per Machine Model
kV
V
16
400
Total Power Dissipation on FR−4 Board (Note 1) @ T = 25°C
°P °
500
−55 to +150
260
mW
°C
A
D
Junction and Storage Temperature Range
T , T
J
stg
Lead Solder Temperature − Maximum (10 Second Duration)
T
L
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2
1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm .
www.umw-ic.com
1
UTD Semiconductor Co.,Limited