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ESD5Z2.5T1G/T5G PDF预览

ESD5Z2.5T1G/T5G

更新时间: 2024-11-21 01:03:11
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 70K
描述
Transient Voltage suppressors

ESD5Z2.5T1G/T5G 数据手册

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ESD5Z2.5T1G Series,  
SZESD5Z2.5T1G Series  
Transient Voltage  
Suppressors  
Micro−Packaged Diodes for ESD Protection  
http://onsemi.com  
The ESD5Z Series is designed to protect voltage sensitive  
components from ESD and transient voltage events. Excellent  
clamping capability, low leakage, and fast response time, make these  
parts ideal for ESD protection on designs where board space is at a  
premium. Because of its small size, it is suited for use in cellular  
phones, portable devices, digital cameras, power supplies and many  
other portable applications.  
SOD−523  
CASE 502  
STYLE 1  
Specification Features:  
1
2
Low Clamping Voltage  
Cathode  
Anode  
Small Body Outline Dimensions:  
0.047x 0.032(1.20 mm x 0.80 mm)  
Low Body Height: 0.028(0.7 mm)  
Stand−off Voltage: 2.5 V − 12 V  
MARKING DIAGRAM  
Peak Power up to 240 Watts @ 8 x 20 ms Pulse  
Low Leakage  
XX  
G
2
1
Response Time is Typically < 1 ns  
XX = Specific Device Code  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
IEC61000−4−2 Level 4 ESD Protection  
IEC61000−4−4 Level 4 EFT Protection  
M
= Date Code  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
*Date Code orientation may vary  
depending upon manufacturing location.  
These Devices are Pb−Free and are RoHS Compliant*  
ORDERING INFORMATION  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V−0  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
Device  
Package  
Shipping  
SZ/ESD5ZxxxT1G  
SOD−523  
Pb−Free  
3000 /  
Tape & Reel  
ESD5ZxxxT5G  
SOD−523  
Pb−Free  
8000 /  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics tables starting on  
page 3 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
December, 2014 − Rev. 13  
ESD5Z2.5T1/D  

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