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ESD5004

更新时间： 2024-02-13 20:06:18
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 95K
描述
ESD Protection Diode

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中文翻译

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ESD5004 技术参数

是否无铅：不含铅生命周期：Active
Reach Compliance Code：compliantFactory Lead Time：4 weeks
风险等级：1.59Is Samacsys：N
二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE湿度敏感等级：1
峰值回流温度（摄氏度）：NOT SPECIFIED端子面层：Nickel/Gold/Palladium (Ni/Au/Pd)
处于峰值回流温度下的最长时间：NOT SPECIFIEDBase Number Matches：1

ESD5004 数据手册

 浏览型号ESD5004的Datasheet PDF文件第2页浏览型号ESD5004的Datasheet PDF文件第3页浏览型号ESD5004的Datasheet PDF文件第4页浏览型号ESD5004的Datasheet PDF文件第5页 
ESD5004  
ESD Protection Diode  
Low Capacitance ESD Protection Diode  
The ESD5004 is designed for applications requiring ESD  
protection. It is intended to be used in sensitive equipment such as  
smartphone, wireless headsets, digital cameras, computers, printers,  
communication systems, and other applications. The integrated design  
provides very effective and reliable protection for four separate lines  
using only one package. This device is ideal for situations where board  
space is at a premium.  
www.onsemi.com  
MARKING  
DIAGRAM  
X3DFN4  
CASE 714AA  
Features  
4M  
• Low Capacitance (5 pF Max, I/O to GND)  
• Four Separate Bi−directional Configurations for Protection  
4
M
= Specific Device Code  
= Date Code  
• Protection for the Following IEC Standards:  
IEC 61000−4−2 (Level 4)  
• Low ESD Clamping Voltage  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
PIN CONFIGURATION  
AND SCHEMATIC  
Typical Applications  
2
1
3
4
• Smartphone and Portable Electronics  
• Notebooks, Desktops, Servers  
• Microprocessor Based Equipment  
5
(Bottom View)  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
−55 to +125  
−65 to +150  
260  
Unit  
°C  
1
2
3
4
Operating Junction Temperature Range  
Storage Temperature Range  
T
J
T
stg  
°C  
Lead Solder Temperature −  
Maximum (10 Seconds)  
T
L
°C  
IEC 61000−4−2 Contact (ESD)  
IEC 61000−4−2 Air (ESD)  
ESD  
ESD  
12  
15  
kV  
kV  
5
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
†
Device  
ESD5004MXTBG  
Package  
Shipping  
X3DFN4  
8000 /  
(Pb−Free)  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
See Application Note AND8308/D for further description of  
survivability specs.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
April, 2017 − Rev. 3  
ESD5004/D  
12345

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