ESD5004
ESD Protection Diode
Low Capacitance ESD Protection Diode
The ESD5004 is designed for applications requiring ESD
protection. It is intended to be used in sensitive equipment such as
smartphone, wireless headsets, digital cameras, computers, printers,
communication systems, and other applications. The integrated design
provides very effective and reliable protection for four separate lines
using only one package. This device is ideal for situations where board
space is at a premium.
www.onsemi.com
MARKING
DIAGRAM
X3DFN4
CASE 714AA
Features
4M
• Low Capacitance (5 pF Max, I/O to GND)
• Four Separate Bi−directional Configurations for Protection
4
M
= Specific Device Code
= Date Code
• Protection for the Following IEC Standards:
IEC 61000−4−2 (Level 4)
• Low ESD Clamping Voltage
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
PIN CONFIGURATION
AND SCHEMATIC
Typical Applications
2
1
3
4
• Smartphone and Portable Electronics
• Notebooks, Desktops, Servers
• Microprocessor Based Equipment
5
(Bottom View)
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Symbol
Value
−55 to +125
−65 to +150
260
Unit
°C
1
2
3
4
Operating Junction Temperature Range
Storage Temperature Range
T
J
T
stg
°C
Lead Solder Temperature −
Maximum (10 Seconds)
T
L
°C
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
ESD
ESD
12
15
kV
kV
5
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
†
Device
ESD5004MXTBG
Package
Shipping
X3DFN4
8000 /
(Pb−Free)
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of
survivability specs.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
April, 2017 − Rev. 3
ESD5004/D