SPICE MODELS: ES2A ES2B ES2C ES2D ES2AA ES2BA ES2CA ES2DA
ES2A/A - ES2D/A
2.0A SURFACE MOUNT SUPER-FAST RECTIFIER
Features
•
•
•
•
•
Glass Passivated Die Construction
Super-Fast Recovery Time For High Efficiency
Surge Overload Rating to 50A Peak
Ideally Suited for Automated Assembly
Lead Free Finish/RoHS Complaint (Note 4)
SMA
Min
SMB
Min
B
Dim
Max
2.92
4.60
1.63
0.31
5.59
0.20
1.52
2.30
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.40
A
B
C
D
E
G
H
J
2.29
4.00
1.27
0.15
4.80
0.10
0.76
2.01
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
A
C
Mechanical Data
•
•
Case: SMA/SMB
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
D
•
•
Moisture Sensitivity: Level 1 per J-STD-020C
J
Terminals: Lead Free Plating (Matte Tin
Finish). Solderable per MIL-STD-202, Method 208
e3
G
H
E
•
•
•
•
•
Polarity: Cathode Band or Cathode Notch
Marking Information: See Page 3
All Dimensions in mm
Ordering Information: See Page 3
AA, BA, CA, DA Suffix Designates SMA Package
A, B, C, D, Suffix Designates SMB Package
SMA Weight: 0.064 grams (approximate)
SMB Weight: 0.093 grams (approximate)
@ TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
ES2A/A
50
ES2B/A
100
ES2C/A
150
ES2D/A
200
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 5)
V
VR(RMS)
IO
RMS Reverse Voltage
35
70
105
140
V
A
Average Rectified Output Current
@ TT = 110°C
2.0
50
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
IFSM
VFM
IRM
A
V
Forward Voltage
@ IF = 2.0A
0.92
5.0
350
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
@ TA 25°C
=
µA
@ TA = 125°C
trr
CT
Reverse Recovery Time (Note 3)
Typical Total Capacitance (Note 2)
25
25
20
ns
pF
RθJT
Tj, TSTG
Typical Thermal Resistance, Junction to Terminal (Note 1)
Operating and Storage Temperature Range
°C/W
°C
-55 to +150
2
Notes:
1. Unit mounted on PC board with 5.0 mm (0.013 mm thick) copper pads as heat sink.
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Measured with I = 0.5A, I = 1.0A, I = 0.25A. See Figure 5.
F
R
rr
4. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
5. Short duration pulse test used to minimize self-heating effect.
DS14002 Rev. 10 - 2
1 of 3
ES2A/A - ES2D/A
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