ES1AL thru ES1JL
Taiwan Semiconductor
CREAT BY ART
Surface Mount Super Fast Rectifiers
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Low power loss, high efficiency
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
Case: Sub SMA
Sub SMA
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.019 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
ES
ES
ES
ES
ES
ES
ES
ES
PARAMETER
SYMBOL
UNIT
1AL 1BL 1CL 1DL 1FL 1GL 1HL 1JL
Marking code
EAL
50
EBL ECL EDL
EFL EGL EHL
EJL
600
420
600
Maximum repetitive peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
VDC
100
70
150
105
150
200
140
200
300
210
300
400
280
400
500
350
500
V
V
V
A
35
Maximum DC blocking voltage
Maximum average forward rectified current
50
100
IF(AV)
1
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
VF
IR
30
A
V
Maximum instantaneous forward voltage (Note 1)
@ 1 A
0.95
1.3
1.7
5
Maximum reverse current @ rated VR TJ=25 ℃
TJ=125 ℃
μA
100
Typical junction capacitance (Note 2)
10
8
Cj
pF
ns
Maximum reverse recovery time (Note 3)
35
Trr
RθJL
RθJA
35
85
OC/W
Typical thermal resistance
OC
OC
Operating junction temperature range
TJ
- 55 to +150
- 55 to +150
Storage temperature range
TSTG
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.
Note 3: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Document Number: DS_D1405035
Version: I14