Datasheet > EPM240T100I4N

EPM240T100I4N

更新时间： 2023-04-15 00:00:00

品牌	Logo	应用领域
英特尔 - INTEL		/
页数	文件大小	规格书
86页	1210K
描述
Flash PLD, 6.1ns, 192-Cell, CMOS, PQFP100, 16 X 16 MM, 0.50 MM PITCH, LEAD FREE, TQFP-100

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EPM240T100I4N 数据手册

Chapter 1: Introduction

1–3

Features

MAX II devices are available in space-saving FineLine BGA, Micro FineLine BGA, and

thin quad flat pack (TQFP) packages (refer to Table 1–3 and 1–3). MAX II devices

support vertical migration within the same package (for example, you can migrate

between the EPM570, EPM1270, and EPM2210 devices in the 256-pin FineLine BGA

package). Vertical migration means that you can migrate to devices whose dedicated

pins and JTAG pins are the same and power pins are subsets or supersets for a given

package across device densities. The largest density in any package has the highest

number of power pins; you must lay out for the largest planned density in a package

to provide the necessary power pins for migration. For I/O pin migration across

densities, cross reference the available I/O pins using the device pin-outs for all

planned densities of a given package type to identify which I/O pins can be migrated.

The Quartus II software can automatically cross-reference and place all pins for you

when given a device migration list.

Table 1–3. MAX II Packages and User I/O Pins

68-Pin

Micro

100-Pin

Micro

144-Pin

Micro

256-Pin

Micro

100-Pin

256-Pin

324-Pin

FineLine FineLine FineLine 100-Pin 144-Pin FineLine

FineLine FineLine FineLine

Device

EPM240

BGA (1)

TQFP

BGA (1)

BGA

—

EPM240G

EPM570

—

116

—

160

212

—

160

212

204

—

EPM570G

EPM1270

EPM1270G

EPM2210

EPM2210G

EPM240Z

EPM570Z

Note to Table 1–3:

272

—

116

160

(1) Packages available in lead-free versions only.

Table 1–4. MAX II TQFP, FineLine BGA, and Micro FineLine BGA Package Sizes

68-Pin

Micro

100-Pin

Micro

144-Pin

Micro

256-Pin

Micro

100-Pin

256-Pin

324-Pin

FineLine FineLine FineLine 100-Pin 144-Pin FineLine FineLine FineLine FineLine

Package

Pitch (mm)

Area (mm2)

BGA

TQFP

BGA

0.5

121

256

484

121

289

361

Length × width

(mm × mm)

5 × 5

6 × 6

11 × 11

16 × 16 22 × 22

7 × 7

11 × 11

17 × 17

19 × 19

MAX II Device Handbook

1 2 3 456 7 8...86

中文翻译

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与EPM240T100I4N相关器件

型号	品牌	获取价格	描述	数据表
EPM240T100I5	ALTERA	获取价格	Flash PLD, 7.5ns, 192-Cell, CMOS, PQFP100, 16 X 16 MM, 0.50 MM PITCH, TQFP-100
EPM240T100I5	INTEL	获取价格	Flash PLD, 7.5ns, 192-Cell, CMOS, PQFP100, 16 X 16 MM, 0.50 MM PITCH, TQFP-100
EPM240T100I5ES	INTEL	获取价格	Flash PLD, PQFP100, 16 X 16 MM, 1MM PITCH, TQFP-100
EPM240T100I5N	ALTERA	获取价格	Flash PLD, 7.5ns, 192-Cell, CMOS, PQFP100, 16 X 16 MM, 0.50 MM PITCH, LEAD FREE, TQFP-100
EPM240T100I5N	INTEL	获取价格	Flash PLD, 7.5ns, 192-Cell, CMOS, PQFP100, 16 X 16 MM, 0.50 MM PITCH, LEAD FREE, TQFP-100
EPM240Z	ALTERA	获取价格	MAX II Device Family Data
EPM240Z100C5N	ALTERA	获取价格	The MAX II family of instant-on, non-volatile CPLDs is based on a 0.18-m,
EPM240ZF100A	ALTERA	获取价格	MAX II Device Family
EPM240ZF100C	ALTERA	获取价格	MAX II Device Family
EPM240ZF100I	ALTERA	获取价格	MAX II Device Family

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