EMP25P12B
I27149 08/07
Pins Mapping
Symbol
Lead Description
DC IN+
DC IN-
DC +
DC -
Th +
DC Bus plus power input pin
DC Bus minus power input pin
DC Bus plus signal connection (Kelvin point)
DC Bus minus signal connection (Kelvin point)
Thermal sensor positive input
Th -
Thermal sensor negative input
Sh +
Sh -
DC Bus minus series shunt positive input (Kelvin point)
DC Bus minus series shunt negative input (Kelvin point)
Gate connections for high side IGBTs
Emitter connections for high side IGBTs (Kelvin points)
Output current sensing resistor positive input (IGBTs emitters 1/2/3 side, Kelvin points)
Output current sensing resistor negative input (Motor side, Kelvin points)
Gate connections for low side IGBTs
G1/2/3
E1/2/3
R1/2/3 +
R1/2/3 -
G4/5/6
E4/5/6
OUT1/2/3
Emitter connections for low side IGBTs (Kelvin points)
Three phase power output pins
Absolute Maximum Ratings (TC=25ºC)
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur.
All voltage parameters are absolute voltages referenced to VDC-, all currents are defined positive into any lead.
Thermal Resistance and Power Dissipation ratings are measured at still air conditions.
Symbol
Parameter Definition
Min.
Max.
1000
1200
25
Units
VDC
DC Bus Voltage
0
0
V
VCES
Collector Emitter Voltage
º
IC @ 100C
IC @ 25C
ICM
IGBTs continuous collector current (TC = 100 C, fig. 1)
º
50
IGBTs continuous collector current (TC = 25 C,fig 1)
Pulsed Collector Current (Fig. 3, Fig. CT.5)
100
25
A
º
Inverter
IF @ 100C
IF @ 25C
IFM
Diode Continuous Forward Current (TC = 100 C)
º
50
Diode Continuous Forward Current (TC = 25 C)
Diode Maximum Forward Current
Gate to Emitter Voltage
100
+20
192
77
VGE
-20
V
PD @ 25°C
PD @ 100°C
MT
Power Dissipation (One transistor)
W
º
Power Dissipation (One transistor, TC = 100 C)
Mounting Torque
3.5
Nm
ºC
V
T J
Operating Junction Temperature
Storage Temperature Range
Isolation Voltage to Base Copper Plate
-40
-40
+150
+125
+2500
Power
Module
TSTG
Vc-iso
-2500
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