MMIC Bi-Directional Coupler die
EBDC19-KA-D+
Additional Detailed Technical Information
additional information is available on our dash board.
Data Table
Performance Data
Case Style
Swept Graphs
S-Parameter (S4P Files±
Die
Quantitꢁ, Package
Model No.
Small, Gel - Pak: 5, KGD*
EBDC19-KA-DG+
EBDC19-KA-DP+
Medium†, Partial wafer: 350 KGD*
Die Ordering and packaging
information
†Available upon request contact sales representative
Refer to AN-60-067
Environmental Ratings
ENV80
*Known Good Dice (“KGD”± means that the dice are taken from PCM good wafer and ꢂisuallꢁ inspected according to Mini-Circuits inspection criteria.
While this is not definitiꢂe, it does help to proꢂide a higher degree of confidence that dice are capable of meeting tꢁpical RF electrical parameters
specified bꢁ Mini-Circuits.
ESD Rating
Human Bodꢁ Model (HBM±: Class 1C (Pass 1000V± in accordance with ANSI/ESD STM 5.1 - ꢃ001
Additional Notes
A. Performance and qualitꢁ attributes and conditions not expresslꢁ stated in this specification document are intended
to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s
applicable established test performance criteria and measurement instructions.
C. The parts coꢂered bꢁ this specification document are subject to Mini-Circuits standard limited warrantꢁ and terms
and conditions (collectiꢂelꢁ, “Standard Terms”±; Purchasers of this part are entitled to the rights and benefits
contained therein. For a full statement of the Standard Terms and the exclusiꢂe rights and remedies thereunder,
please ꢂisit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
D. Mini-Circuits does not warrant the accuracꢁ or completeness of the information, text, graphics and other items
contained within this document and same are proꢂided as an accommodation and on an “As is” basis, with all faults.
E. Purchasers of this part are solelꢁ responsible for proper storing, handling, assemblꢁ and processing of Known
Good Dice (including, without limitation, proper ESD preꢂentatiꢂe measures, die preparation, die attach, wire bond
ing and related assemblꢁ and test actiꢂities±, and Mini-Circuits assumes no responsibilitꢁ therefor or for enꢂironmental
effects on Known Good Dice.
F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini-
Circuits. All other third-partꢁ trademarks are the propertꢁ of their respectiꢂe owners. A reference to anꢁ third-partꢁ
trademark does not constitute or implꢁ anꢁ endorsement, affiliation, sponsorship, or recommendation bꢁ anꢁ such
third-partꢁ of Mini-Circuits or its products.
®
Mini-Circuits
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
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