Datasheet > EBDC19-KA-D

EBDC19-KA-D

更新时间： 2022-02-26 13:43:54

品牌	Logo	应用领域
MINI		/
页数	文件大小	规格书
5页	192K
描述
Bi-Directional Coupler Die

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EBDC19-KA-D 数据手册

MMIC

EBDC19-KA-D+

Bi-Directional Coupler Die

50Ω

5 to 43.5 GHz

Product Features

• Wide bandwidth, 5 to 43.5 GHz

• Excellent Coupling Flatness, ± 0.ꢀ dB oꢂer ꢃ0 to 40 GHz

• Nominal Coupling 18.ꢀ dB oꢂer ꢃ0 to 40 GHz

• DC passing

+RoHS Compliant

ꢀhe ꢁꢂuffiꢃ identifies Roꢄꢂ Compliance. ꢂee our ꢅeb site

for Roꢄꢂ Compliance methodologies and qualifications

Typical Applications

• 5G

Ordering Information: Refer to Last Page

• Instrumentation

• Militarꢁ

General Description

Mini-Circuits’ EBDC19-KA-D+ is a Bi-Directional Coupler die designed for wideband operation from 5 to

43.5 GHz with a nominal coupling of 18.7 dB oꢂer ꢃ0-40 GHz. Manufactured using GaAs IPD technologꢁ,

it has excellent repeatabilitꢁ and excellent reliabilitꢁ.

Simpliﬁed Schematic and Pad description

Bonding Pad Position

Pad#

Function

Input

ꢃ

Output

Dimensions in µm, Tꢁpical

Couple Forward

Couple Reꢂerse

Ground

Lꢃ

Hꢃ

Die Bottom

134

39ꢃ

1199 145ꢀ 1590 1ꢃ4

370

9ꢃ1 11ꢀꢀ 1ꢃ90 100 117 x 1ꢀ7 1ꢀ7 x 117

Note: 1. Bond Pad material - Gold

ꢃ. Bottom of Die - Gold plated

REV. OR

M1ꢀ57ꢀ1

EBDC19-KA-D+

RS/CP

180ꢃꢃ0

Page ꢃ of 5

Mini-Circuits

www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com

123 4 5

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