Datasheet > EBDC19-KA-D

EBDC19-KA-D

更新时间： 2022-02-26 13:43:54

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EBDC19-KA-D 数据手册

EBDC19-KA-D+

MMIC Bi-Directional Coupler die

Assembly Diagram

Forward

Note: Ground bond wire are optional

Reꢂerse

Note: Ground bond wires are optional

Assembly and Handling Procedure

1. Storage

Dice should be stored in a drꢁ nitrogen purged desiccators or equiꢂalent.

ꢃ. ESD

MMIC coupler dice are susceptible to electrostatic and mechanical damage. Die are supplied in

antistatic protected material, which should be opened in clean room conditions at an appropriatelꢁ grounded anti-static worksta

tion. Deꢂices need careful handling using correctlꢁ designed collets, ꢂacuum pickup tips or sharp antistatic tweezers to deter

ESD damage to dice.

3. Die Attach

The die mounting surface must be clean and ﬂat. Using conductiꢂe silꢂer ﬁlled epoxꢁ, recommended epoxies are DieMat

DMꢀ030HK-PT/H579 or Ablestik 84-1LMISR4. Applꢁ sufﬁcient epoxꢁ to meet required epoxꢁ bond line thickness, epoxꢁ ﬁllet

height and epoxꢁ coꢂerage around total die peripherꢁ. Parts shall be cured in a nitrogen ﬁlled atmosphere per manufacturer’s

cure condition. It is recommended to use antistatic die pick up tools onlꢁ.

4. Wire Bonding

Bond pad openings in the surface passiꢂation aboꢂe the bond pads are proꢂided to allow wire bonding to the dice gold bond

pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are

all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to

the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due

to undesirable series inductance.

Mini-Circuits

www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com

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