DZT2907A
PNP SURFACE MOUNT TRANSISTOR
Features
3
2
1
•
•
•
•
•
•
Epitaxial Planar Die Construction
Complementary NPN Type Available (DZT2222A)
Ideally Suited for Automated Assembly Processes
Ideal for Medium Power Amplification and Switching
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
4
SOT-223
COLLECTOR
Mechanical Data
3 E
2 C
2,4
•
•
Case: SOT-223
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
C 4
1
BASE
B
1
•
•
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish - Matte Tin annealed over Copper Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
3
EMITTER
TOP VIEW
•
•
•
Marking & Type Code Information: See Page 4
Ordering Information: See Page 4
Weight: 0.115 grams (approximate)
Schematic and Pin Configuration
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Symbol
Value
-60
Unit
V
VCBO
VCEO
VEBO
IC
Collector-Emitter Voltage
-60
V
Emitter-Base Voltage
-5
V
Collector Continuous Current (Note 3)
Peak Collector Current
-600
-800
mA
mA
ICM
Thermal Characteristics
Characteristic
Symbol
Value
Unit
1000 (Note 3)
1500 (Note 4)
12
mW
Power Dissipation @ TA = 25°C
Pd
Power Derating Factor above 25°C (Note 4)
Operating and Storage Temperature Range
Pder
mW/°C
°C
οC/W
-55 to +150
83.3
Tj, TSTG
Thermal Resistance, Junction to Ambient Air @ TA = 25°C (Note 4)
Rθ
JA
Notes:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on 2” x 2” FR-4 PC board, 2 oz. copper, single sided, pad layout as shown on page 4, or on Diodes Inc. suggested pad
layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
4. Device mounted on FR-4 PCB, 7cm2 of copper pad area.
DS30921 Rev. 5 - 2
1 of 4
DZT2907A
© Diodes Incorporated
www.diodes.com