DU2810S
RF Power MOSFET Transistor
10 W, 2 - 175 MHz, 28 V
Rev. V1
Features
Package Outline
N-Channel enhancement mode device
DMOS structure
Lower capacitances for broadband operation
Common source configuration
Low noise floor
RoHS Compliant
ABSOLUTE MAXIMUM RATINGS AT 25° C
Parameter
Symbol
VDS
VGS
IDS
Rating
Units
V
Drain-Source Voltage
Gate-Source Voltage
Drain-Source Current
Power Dissipation
65
20
V
2.8
A
PD
35
W
Junction Temperature
Storage Temperature
Thermal Resistance
TJ
200
-65 to +150
2
°C
TSTG
θJC
°C
°C/W
LETTER
MILLIMETERS
INCHES
DIM
A
MIN
24.64
18.29
20.07
9.47
6.22
5.64
2.92
2.29
4.04
6.58
.10
MAX
24.89
18.54
20.83
9.73
6.48
5.79
3.30
2.67
4.55
7.39
.15
MIN
.970
.720
.790
.373
.245
.222
.115
.090
.159
.259
.004
MAX
.980
.730
.820
.383
.255
.228
.130
.105
.179
.291
.006
TYPICAL DEVICE IMPEDANCE
F (MHz)
30
ZIN (Ω)
ZLOAD (Ω)
B
20 - j11.0
23.0 + j3.0
19.0 +j5.0
14.0 + j6.0
9.0 + j5.0
C
D
E
50
24.0 - j15.0
18.0 - j18.0
12.0—j19.0
100
200
F
VDD = 28V, IDQ = 100mA, POUT = 10.0W
G
H
J
ZIN is the series equivalent input impedance of the device
from gate to source.
K
ZLOAD is the optimum series equivalent load impedance
as measured from drain to ground.
L
ELECTRICAL CHARACTERISTICS AT 25°C
Parameter
Drain-Source Breakdown Voltage
Drain-Source Leakage Current
Gate-Source Leakage Current
Gate Threshold Voltage
Forward Transconductance
Input Capacitance
Symbol Min Max
Units
V
Test Conditions
BVDSS
IDSS
65
-
2.0
2.0
6.0
-
VGS = 0.0 V , IDS = 4.0 mA
VGS = 28.0 V , VGS = 0.0 V
VGS = 20.0 V , VDS = 0.0 V
VDS = 10.0 V , IDS = 20 mA
-
-
mA
µA
V
IGSS
VGS(TH)
GM
2.0
160
-
S
VDS = 10.0 V , IDS = 200 mA , Pulsed 80-300 μs
VDS = 28.0 V , F = 1.0 MHz
CISS
14
10
4.6
-
pF
pF
pF
dB
%
COSS
Output Capacitance
-
VDS = 28.0 V , F = 1.0 MHz
Reverse Capacitance
Power Gain
CRSS
GP
-
VDS = 28.0 V , F = 1.0 MHz
13
55
-
VDD = 28.0 V, IDQ = 100 mA, POUT = 10 W F =175 MHz
VDD = 28.0 V, IDQ = 100 mA, POUT = 10 W F =175 MHz
VDD = 28.0 V, IDQ = 100 mA, POUT = 10 W F =175 MHz
Drain Efficiency
ŋD
-
Load Mismatch Tolerance
VSWR-T
20:1
-
1
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