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DTC114ES3_16 PDF预览

DTC114ES3_16

更新时间: 2022-02-26 14:00:17
品牌 Logo 应用领域
全宇昕 - CYSTEKEC /
页数 文件大小 规格书
6页 269K
描述
NPN Digital Transistors (Built-in Resistors)

DTC114ES3_16 数据手册

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Spec. No. : C351S3  
Issued Date : 2002.06.01  
Revised Date : 2016.07.18  
Page No. : 6/6  
CYStech Electronics Corp.  
SOT-323 Dimension  
3
Marking:  
A
Q
C
A1  
Device Code  
Date Code  
8A  
Lp  
1
2
detail Z  
bp  
e1  
W
B
e
A
E
Z
D
3-Lead SOT-323 Plastic  
Surface Mounted Package  
CYStek Package Code: S3  
θ
v
A
He  
mm  
2
0
1
Style: Pin 1.Base 2.Emitter 3.Collector  
scale  
*: Typical  
Inches  
Min. Max.  
Millimeters  
Inches  
Min. Max.  
Millimeters  
DIM  
DIM  
Min.  
0.80  
0.00  
0.20  
0.08  
1.80  
1.15  
1.20  
Max.  
1.10  
0.10  
0.40  
0.15  
2.20  
1.35  
1.40  
Min.  
Max.  
A
A1  
bp  
C
D
E
0.0315 0.0433  
0.0000 0.0039  
0.0078 0.0157  
0.0031 0.0059  
0.0709 0.0866  
0.0453 0.0531  
0.0472 0.0551  
e1  
He  
Lp  
Q
v
w
0.0256*  
0.65*  
0.0846 0.0965  
0.0105 0.0181  
0.0051 0.0091  
2.15  
0.26  
0.13  
0.2  
2.45  
0.46  
0.23  
-
0.0079  
0.0079  
0°  
-
-
8°  
0.2  
-
e
θ
0°  
8°  
Notes: 1.Controlling dimension: millimeters.  
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.  
Material:  
Lead: Pure tin plated.  
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.  
CYStek reserves the right to make changes to its products without notice.  
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
DTC114ES3  
CYStek Product Specification  

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