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DTA123JCA_11 PDF预览

DTA123JCA_11

更新时间: 2024-11-23 09:58:03
品牌 Logo 应用领域
美微科 - MCC 晶体数字晶体管
页数 文件大小 规格书
3页 211K
描述
Digital Transistors

DTA123JCA_11 数据手册

 浏览型号DTA123JCA_11的Datasheet PDF文件第2页浏览型号DTA123JCA_11的Datasheet PDF文件第3页 
M C C  
TM  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
Micro Commercial Components  
DTA123JCA  
Features  
Epitaxial Planar Die Construction  
Complementary NPN Types Available  
Built-In Biasing Resistors  
Lead Free Finish/RoHS Compliant ("P" Suffix designates  
RoHS Compliant. See ordering information)  
Epoxy meets UL 94 V-0 flammability rating  
Moisure Sensitivity Level 1  
xꢀ  
xꢀ  
xꢀ  
·
Digital Transistors  
·
·
SOT-23  
A
Absolute maximum ratings @ 25  
к
D
Symbol  
VCC  
VIN  
Parameter  
Min  
---  
Typ  
50  
Max  
---  
Unit  
V
3
Supply voltage  
Input voltage  
-5  
---  
---  
+12  
---  
V
mW  
B
C
Pd  
Power dissipation  
Junction temperature  
200  
150  
1:IN  
Tj  
---  
---  
ć
ć
2
1
2:GND  
3:OUT  
Tstg  
IO  
Storage temperature  
-55  
---  
150  
F
E
100  
100  
Output current  
mA  
IC(MAX)  
Electrical Characteristics @ 25  
к
H
G
J
Symbol  
VI(off)  
VI(on)  
VO(on)  
II  
Parameter  
Min  
---  
Typ  
---  
Max  
0.5  
---  
Unit  
V
Input voltage (VCC=5V, IO=100 A)  
­
K
1.1  
---  
---  
V
(VO=0.3V, IO=5mA)  
Output voltage (IO=5mA,Ii=0.25mA)  
Input current (VI=5V)  
DIMENSIONS  
0.1  
---  
0.3  
3.6  
0.5  
---  
V
mA  
---  
INCHES  
MM  
IO(off)  
GI  
Output current (VCC=50V, VI=0)  
DC current gain (VO=5V, IO=10mA)  
Input resistance  
---  
---  
A
­
DIM  
A
B
C
D
E
MIN  
.110  
.083  
.047  
.035  
.070  
.018  
.0005  
.035  
.003  
.015  
MAX  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
NOTE  
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
80  
---  
R1  
1.54  
17  
2.2  
21  
2.86  
26  
K
¡
R2/R1  
Resistance ratio  
Transition frequency  
(VCE=10V, IE=5mA, f=100MHz)  
fT  
---  
250  
---  
MHz  
F
G
H
J
.100  
1.12  
.180  
.51  
.085  
.37  
K
Suggested Solder  
Pad Layout  
*Marking: E32  
.031  
.800  
.035  
.900  
.079  
2.000  
inches  
mm  
.037  
.950  
.037  
.950  
www.mccsemi.com  
1 of 3  
Revision: A  
2011/01/01  

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