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DS3166N PDF预览

DS3166N

更新时间: 2024-02-02 10:15:48
品牌 Logo 应用领域
美信 - MAXIM ATM异步传输模式电信电信集成电路
页数 文件大小 规格书
386页 4134K
描述
Transceiver, 1-Func, PBGA676, 27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676

DS3166N 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:27 X 27 MM, 2.28 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-676针数:676
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
风险等级:5.92应用程序:ATM;SDH;SONET
JESD-30 代码:S-PBGA-B676JESD-609代码:e0
长度:27 mm功能数量:1
端子数量:676最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):225
认证状态:Not Qualified座面最大高度:2.41 mm
标称供电电压:1.8 V表面贴装:YES
电信集成电路类型:ATM/SONET/SDH TRANSCEIVER温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:27 mm
Base Number Matches:1

DS3166N 数据手册

 浏览型号DS3166N的Datasheet PDF文件第4页浏览型号DS3166N的Datasheet PDF文件第5页浏览型号DS3166N的Datasheet PDF文件第6页浏览型号DS3166N的Datasheet PDF文件第8页浏览型号DS3166N的Datasheet PDF文件第9页浏览型号DS3166N的Datasheet PDF文件第10页 
DS3166/DS3168/DS31612  
12.12.2 Receive Side PLCP Register Map..................................................................................................... 315  
12.13 FIFO REGISTERS........................................................................................................................................ 323  
12.13.1 Transmit FIFO Register Map.............................................................................................................. 323  
12.13.2 Receive FIFO Register Map............................................................................................................... 327  
12.14 CELL/PACKET PROCESSOR.......................................................................................................................... 329  
12.14.1 Transmit Cell Processor Register Map .............................................................................................. 329  
12.14.2 Receive Cell Processor...................................................................................................................... 337  
12.14.3 Transmit Packet Processor Register Map ......................................................................................... 347  
12.14.4 Receive Packet Processor Register Map .......................................................................................... 352  
13 JTAG INFORMATION  
361  
13.1 JTAG DESCRIPTION.................................................................................................................................... 361  
13.2 JTAG TAP CONTROLLER STATE MACHINE DESCRIPTION ............................................................................. 362  
13.3 JTAG INSTRUCTION REGISTER AND INSTRUCTIONS ...................................................................................... 364  
13.4 JTAG ID CODES......................................................................................................................................... 365  
13.5 JTAG FUNCTIONAL TIMING.......................................................................................................................... 366  
13.6 IO PINS ...................................................................................................................................................... 366  
14 PIN ASSIGNMENT  
367  
371  
372  
373  
376  
15 PACKAGE MECHANICAL DIMENSIONS  
16 PACKAGE THERMAL INFORMATION  
17 DC ELECTRICAL CHARACTERISTICS  
18 AC TIMING CHARACTERISTICS  
18.1 FRACTIONAL PORT AC CHARACTERISTICS.................................................................................................... 378  
18.2 LINE INTERFACE AC CHARACTERISTICS ....................................................................................................... 378  
18.3 MISC PIN AC CHARACTERISTICS.................................................................................................................. 379  
18.4 OVERHEAD PORT AC CHARACTERISTICS...................................................................................................... 379  
18.5 SYSTEM INTERFACE AC CHARACTERISTICS.................................................................................................. 380  
18.6 MICRO INTERFACE AC CHARACTERISTICS.................................................................................................... 382  
18.7 JTAG INTERFACE AC CHARACTERISTICS..................................................................................................... 385  
19 REVISION HISTORY  
386  
7

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