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DS3141 PDF预览

DS3141

更新时间: 2024-02-28 22:46:44
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
88页 1068K
描述
Single/Dual/Triple/Quad DS3/E3 Framers

DS3141 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:BGA
包装说明:BGA,针数:144
Reach Compliance Code:unknown风险等级:5.9
JESD-30 代码:S-PBGA-B144长度:13 mm
湿度敏感等级:3功能数量:1
端子数量:144最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):240
认证状态:COMMERCIAL座面最大高度:1.75 mm
标称供电电压:3.3 V表面贴装:YES
电信集成电路类型:FRAMER温度等级:INDUSTRIAL
端子面层:NOT SPECIFIED端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:20宽度:13 mm

DS3141 数据手册

 浏览型号DS3141的Datasheet PDF文件第1页浏览型号DS3141的Datasheet PDF文件第2页浏览型号DS3141的Datasheet PDF文件第4页浏览型号DS3141的Datasheet PDF文件第5页浏览型号DS3141的Datasheet PDF文件第6页浏览型号DS3141的Datasheet PDF文件第7页 
DS3141/DS3142/DS3143/DS3144 Single/Dual/Triple/Quad DS3/E3 Framers  
7.10.2 Transmit Operation .............................................................................................................................. 54  
7.10.3 HDLC Register Description.................................................................................................................. 54  
7.11  
FEAC CONTROLLER ............................................................................................................... 62  
7.11.1 FEAC Register Description.................................................................................................................. 63  
8. OPERATION DETAILS ................................................................................................................. 67  
8.1 RESET....................................................................................................................................... 67  
8.2 DS3 AND E3 MODE CONFIGURATION .......................................................................................... 67  
8.3 LIU AND SYSTEM INTERFACE CONFIGURATION............................................................................. 67  
8.4 LOOPBACK MODES..................................................................................................................... 68  
8.5 TRANSMIT OVERHEAD INSERTION................................................................................................ 68  
9. JTAG INFORMATION................................................................................................................... 69  
9.1 JTAG TAP CONTROLLER STATE MACHINE.................................................................................. 69  
9.2 JTAG INSTRUCTION REGISTER AND INSTRUCTIONS...................................................................... 71  
9.3 JTAG SCAN REGISTERS............................................................................................................. 72  
10. DC ELECTRICAL CHARACTERISTICS....................................................................................... 73  
11. AC TIMING CHARACTERISTICS................................................................................................. 74  
11.1  
11.2  
11.3  
SYSTEM INTERFACE TIMING..................................................................................................... 74  
MICROPROCESSOR INTERFACE TIMING..................................................................................... 76  
JTAG INTERFACE TIMING ........................................................................................................ 81  
12. PIN ASSIGNMENTS ..................................................................................................................... 82  
13. PACKAGE INFORMATION........................................................................................................... 87  
14. THERMAL INFORMATION........................................................................................................... 88  
15. REVISION HISTORY..................................................................................................................... 88  
3 of 88  

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