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DS21FT44N+ PDF预览

DS21FT44N+

更新时间： 2024-10-28 14:49:11
品牌 Logo 应用领域
美信 - MAXIM 电信电信集成电路
页数 文件大小 规格书
117页 685K
描述
Framer, CMOS, PBGA300, 27 X 27 MM, 1.27 MM PITCH, MCMBGA-300

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中文翻译

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DS21FT44N+ 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Obsolete零件包装代码：BGA
包装说明：BGA,针数：300
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：5.63Is Samacsys：N
JESD-30 代码：S-PBGA-B300JESD-609代码：e1
长度：27 mm湿度敏感等级：4
功能数量：1端子数量：300
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：BGA
封装形状：SQUARE封装形式：GRID ARRAY
峰值回流温度（摄氏度）：260认证状态：Not Qualified
座面最大高度：2.53 mm标称供电电压：3.3 V
表面贴装：YES技术：CMOS
电信集成电路类型：FRAMER温度等级：INDUSTRIAL
端子面层：Tin/Silver/Copper (Sn/Ag/Cu)端子形式：BALL
端子节距：1.27 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：30宽度：27 mm
Base Number Matches：1

DS21FT44N+ 数据手册

 浏览型号DS21FT44N+的Datasheet PDF文件第2页浏览型号DS21FT44N+的Datasheet PDF文件第3页浏览型号DS21FT44N+的Datasheet PDF文件第4页浏览型号DS21FT44N+的Datasheet PDF文件第5页浏览型号DS21FT44N+的Datasheet PDF文件第6页浏览型号DS21FT44N+的Datasheet PDF文件第7页 
DS21FT44/DS21FF44  
4 x 3 12-Channel E1 Framer  
4 x 4 16-Channel E1 Framer  
www.maxim-ic.com  
FEATURES  
APPLICATIONS  
C DSLAMs  
C 16 or 12 completely independent E1 framers  
in one small 27mm x 27mm package  
C Each multichip module (MCM) contains  
either four (FF) or three (FT) DS21Q44 die  
C Each quad framer can be concatenated into a  
single 8.192MHz backplane data stream  
C IEEE 1149.1 JTAG-Boundary Scan  
Architecture  
C Multiplexers/Demultiplexers  
C Switches  
C High-Density Line Cards  
C DS21FF44 and DS21FT44 are pin  
compatible with DS21FF42 and DS21FT42,  
respectively, to allow the same footprint to  
support T1 and E1 applications  
C 300-pin MCM BGA 1.27mm pitch package  
(27mm x 27mm)  
C Low-power 3.3V CMOS with 5V tolerant  
input and outputs  
ORDERING INFORMATION  
PART  
CHANNEL  
PIN-PACKAGE  
TEMP. RANGE  
DS21FT44  
12  
300-BGA, 27mm x 27mm  
0°C to +70°C  
DS21FT44N  
12  
16  
16  
300-BGA, 27mm x 27mm  
300-BGA, 27mm x 27mm  
300-BGA, 27mm x 27mm  
-40°C to +85°C  
DS21FF44  
0°C to +70°C  
DS21FF44N  
-40°C to +85°C  
1. DESCRIPTION  
The 4 x 4 and 4 x 3 MCMs offer a high-density packaging arrangement for the DS21Q44 E1 enhanced  
quad framer. Either three (DS21FT44) or four (DS21FF44) silicon die of these devices is packaged in a  
multichip module (MCM) with the electrical connections as shown in Figure 1-1.  
All of the functions available on the DS21Q44 are also available in the MCM packaged version.  
However, in order to minimize package size, some signals have been deleted or combined. These  
differences are detailed in Table 1-1. In the 4 x 3 (FT) version, the fourth quad framer is not populated  
and thus all the signals to and from this fourth framer are absent and should be treated as no connects  
(NC). Table 2-1 lists all of the signals on the MCM and it also lists the absent signals for the 4 x 3.  
The availability of both a 12-channel and a 16-channel version allow the maximum framer density with  
the lowest cost.  
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device  
may be simultaneously available through various sales channels. For information about device errata, click here: http://www.maxim-ic.com/errata.  
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DS21FT44N+ 替代型号

型号 品牌 替代类型 描述 数据表
DS21458N DALLAS

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