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DS21FT42+ PDF预览

DS21FT42+

更新时间： 2024-10-28 14:49:19
品牌 Logo 应用领域
美信 - MAXIM 电信电信集成电路
页数 文件大小 规格书
114页 692K
描述
Framer, CMOS, PBGA300, 27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-300

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中文翻译

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DS21FT42+ 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：BGA包装说明：27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-300
针数：300Reach Compliance Code：compliant
HTS代码：8542.39.00.01风险等级：5.7
JESD-30 代码：S-PBGA-B300长度：27 mm
功能数量：1端子数量：300
最高工作温度：70 °C最低工作温度：
封装主体材料：PLASTIC/EPOXY封装代码：BGA
封装形状：SQUARE封装形式：GRID ARRAY
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
座面最大高度：2.54 mm标称供电电压：3.3 V
表面贴装：YES技术：CMOS
电信集成电路类型：FRAMER温度等级：COMMERCIAL
端子形式：BALL端子节距：1.27 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：27 mmBase Number Matches：1

DS21FT42+ 数据手册

 浏览型号DS21FT42+的Datasheet PDF文件第2页浏览型号DS21FT42+的Datasheet PDF文件第3页浏览型号DS21FT42+的Datasheet PDF文件第4页浏览型号DS21FT42+的Datasheet PDF文件第5页浏览型号DS21FT42+的Datasheet PDF文件第6页浏览型号DS21FT42+的Datasheet PDF文件第7页 
DS21FT42/DS21FF42  
4 x 3 12-Channel T1 Framer  
4 x 4 16-Channel T1 Framer  
www.maxim-ic.com  
FEATURESP  
C 300-pin MCM 1.27mm pitch BGA package  
(27mm x 27mm)  
C 16 or 12 completely independent T1 framers  
in one small 27mm x 27mm, 1.27mm pitch  
BGA package  
C Low-power 3.3V CMOS with 5V tolerant  
input and outputs  
C Each multichip module (MCM) contains  
four (FF) or three (FT) DS21Q42 die  
C Each quad framer can be concatenated into a  
single 8.192MHz backplane data stream  
C IEEE 1149.1 JTAG-Boundary Scan  
Architecture  
APPLICATIONS  
C DSLAMs  
C Multiplexers/Demultiplexers  
C Switches  
C DS21FF42 and DS21FT42 are pin  
compatible with DS21FF44 and DS21FT44,  
respectively, to allow the same footprint to  
support T1 and E1 applications  
C High-Density Line Cards  
ORDERING INFORMATION  
PART  
CHANNEL  
PIN-PACKAGE  
TEMP RANGE  
DS21FT42  
DS21FT42N  
DS21FF42  
DS21FF42N  
12  
12  
16  
16  
300 BGA, 27mm x 27mm  
300 BGA, 27mm x 27mm  
300 BGA, 27mm x27mm  
300 BGA, 27mm x 27mm  
0°C to +70°C  
-40°C to +85°C  
0°C to +70°C  
-40°C to +85°C  
1. MULTICHIP MODULE DESCRIPTION  
The 4 x 4 and 4 x 3 multichip modules (MCM) offer a high-density packaging arrangement for the  
DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these  
devices is packaged in an MCM with the electrical connections as shown in Figure 1-1.  
All of the functions available on the DS21Q42 are also available in the MCM packaged version.  
However, in order to minimize package size, some signals have been deleted or combined. These  
differences are detailed in Table 1-1. In the 4 x 3 (FT) version, the fourth quad framer is not populated  
and hence all of the signals to and from this fourth framer are absent and should be treated as No  
Connects (NC). Table 2-1 lists all of the signals on the MCM and it also lists the absent signals for the  
4 x 3.  
The availability of both a 12-channel and a 16-channel version allow the maximum framer density with  
the lowest cost. For example, in a T3 application, two devices (one DS21FF42 and one DS21FT42)  
provide 28 framers without the additional cost and power consumption of any unused framers that appear  
in an octal approach.  
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device  
may be simultaneously available through various sales channels. For information about device errata, click here: http://www.maxim-ic.com/errata.  
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 		DATACOM, PCM TRANSCEIVER, PBGA144, 17 X 17 MM, CSBGA-144
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