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DS15BR400 PDF预览

DS15BR400

更新时间: 2024-02-14 16:35:17
品牌 Logo 应用领域
德州仪器 - TI 中继器
页数 文件大小 规格书
23页 624K
描述
具有预加重功能的 4 通道 LVDS 缓冲器/中继器

DS15BR400 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:TFQFP, TQFP48,.35SQ
Reach Compliance Code:compliantECCN代码:5A991.B.1
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:1.25Samacsys Description:LVDS Interface IC 4ch LVDS Buffer/Repeater
差分输出:YES驱动器位数:4
输入特性:DIFFERENTIAL接口集成电路类型:LINE TRANSCEIVER
接口标准:GENERAL PURPOSEJESD-30 代码:S-PQFP-G48
JESD-609代码:e3长度:7 mm
湿度敏感等级:3功能数量:4
端子数量:48最高工作温度:85 °C
最低工作温度:-40 °C最小输出摆幅:2 V
输出特性:DIFFERENTIAL最大输出低电流:0.00001 A
输出极性:COMPLEMENTARY封装主体材料:PLASTIC/EPOXY
封装代码:TFQFP封装等效代码:TQFP48,.35SQ
封装形状:SQUARE封装形式:FLATPACK, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified最大接收延迟:2 ns
接收器位数:4座面最大高度:1.2 mm
子类别:Line Driver or Receivers最大压摆率:215 mA
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V电源电压1-最大:3.6 V
电源电压1-分钟:3 V电源电压1-Nom:3.3 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED最大传输延迟:2 ns
宽度:7 mm

DS15BR400 数据手册

 浏览型号DS15BR400的Datasheet PDF文件第6页浏览型号DS15BR400的Datasheet PDF文件第7页浏览型号DS15BR400的Datasheet PDF文件第8页浏览型号DS15BR400的Datasheet PDF文件第10页浏览型号DS15BR400的Datasheet PDF文件第11页浏览型号DS15BR400的Datasheet PDF文件第12页 
DS15BR400, DS15BR401  
www.ti.com  
SNLS224G AUGUST 2006REVISED APRIL 2013  
Bypass capacitors should be placed close to VDD pins. Small physical size capacitors, such as 0402, X7R,  
surface mount capacitors should be used to minimize body inductance of capacitors. Each bypass capacitor is  
connected to the power and ground plane through vias tangent to the pads of the capacitor. An X7R surface  
mount capacitor of size 0402 has about 0.5 nH of body inductance. At frequencies above 30 MHz or so, X7R  
capacitors behave as low impedance inductors. To extend the operating frequency range to a few hundred MHz,  
an array of different capacitor values like 100 pF, 1 nF, 0.03 µF, and 0.1 µF are commonly used in parallel. The  
most effective bypass capacitor can be built using sandwiched layers of power and ground at a separation of 2–3  
mils. With a 2 mil FR4 dielectric, there is approximately 500 pF per square inch of PCB.  
The center dap of the WQFN package housing the DS15BR400 should be connected to a ground plane through  
an array of vias. The via array reduces the effective inductance to ground and enhances the thermal  
performance of the WQFN package.  
INPUT INTERFACING  
The DS15BR400 and DS15BR401 accept differential signals and allow simple AC or DC coupling. With a wide  
common mode range, the DS15BR400 and DS15BR401 can be DC-coupled with all common differential drivers  
(i.e. LVPECL, LVDS, CML). The following three figures illustrate typical DC-coupled interface to common  
differential drivers. Note that the DS15BR400 inputs are internally terminated with a 100Ω resistor while the  
DS15BR401 inputs are not, therefore the latter requires external input termination.  
LVDS  
Driver  
DS15BR400  
Receiver  
100W Differential T-Line  
OUT+  
IN+  
100W  
IN-  
OUT-  
Figure 11. Typical LVDS Driver DC-Coupled Interface to DS15BR400 Input  
CML3.3V or CML2.5V  
Driver  
V
CC  
DS15BR400  
Receiver  
50W  
50W  
100W Differential T-Line  
OUT+  
OUT-  
IN+  
IN-  
100W  
Figure 12. Typical CML Driver DC-Coupled Interface to DS15BR400 Input  
LVPECL  
Driver  
LVDS  
Receiver  
100W Differential T-Line  
IN+  
IN-  
OUT+  
100W  
OUT-  
150-250W  
150-250W  
Figure 13. Typical LVPECL Driver DC-Coupled Interface to DS15BR400 Input  
Copyright © 2006–2013, Texas Instruments Incorporated  
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Product Folder Links: DS15BR400 DS15BR401  

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