5秒后页面跳转
DPZ256X16IA3-15C PDF预览

DPZ256X16IA3-15C

更新时间: 2024-01-10 02:52:08
品牌 Logo 应用领域
其他 - ETC 闪存内存集成电路可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
14页 990K
描述
x16 Flash EEPROM Module

DPZ256X16IA3-15C 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Contact Manufacturer零件包装代码:PGA
包装说明:APGA, PGA50,5X10针数:50
Reach Compliance Code:unknownECCN代码:3A001.A.2.C
HTS代码:8542.32.00.51风险等级:5.54
Is Samacsys:N最长访问时间:150 ns
备用内存宽度:8数据轮询:NO
JESD-30 代码:R-XPGA-P50长度:25.146 mm
内存密度:4194304 bit内存集成电路类型:FLASH MODULE
内存宽度:16功能数量:1
端子数量:50字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:256KX16封装主体材料:UNSPECIFIED
封装代码:APGA封装等效代码:PGA50,5X10
封装形状:RECTANGULAR封装形式:GRID ARRAY, PIGGYBACK
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V编程电压:12 V
认证状态:Not Qualified座面最大高度:7.4676 mm
最大待机电流:0.0004 A子类别:Flash Memories
最大压摆率:0.065 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:MOS
温度等级:MILITARY端子形式:PIN/PEG
端子节距:2.54 mm端子位置:PERPENDICULAR
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:NO
类型:NOR TYPE宽度:13.716 mm
Base Number Matches:1

DPZ256X16IA3-15C 数据手册

 浏览型号DPZ256X16IA3-15C的Datasheet PDF文件第2页浏览型号DPZ256X16IA3-15C的Datasheet PDF文件第3页浏览型号DPZ256X16IA3-15C的Datasheet PDF文件第4页浏览型号DPZ256X16IA3-15C的Datasheet PDF文件第5页浏览型号DPZ256X16IA3-15C的Datasheet PDF文件第6页浏览型号DPZ256X16IA3-15C的Datasheet PDF文件第7页 
8 Megabit FLASH EEPROM  
DPZ256X32IV3  
DESCRIPTION:  
The DPZ256X32IV3 ‘’VERSA-STACK’’ module is a  
revolutionary new memory subsystem using Dense-Pac  
Microsystems’ ceramic Stackable Leadless Chip Carriers  
(SLCC) mounted on a co-fired ceramic substrate. It offers  
8 Megabits of FLASH EEPROM in a single package  
envelope of 1.090" x 1.090" x .252".  
The DPZ256X32IV3 is built with four SLCC packages  
each containing two 128K x 8 FLASH memory devices.  
Each SLCC is hermetically sealed making the module  
suitable for commercial, industrial and military  
applications.  
By using SLCCs, the ‘’Versa-Stack’’ family of modules  
offers a higher board density of memory than available  
with conventional through-hole, surface mount, module  
or hybrid techniques.  
FEATURES:  
·
Organization:  
256K x 32, 512K x 16  
FUNCTIONAL BLOCK DIAGRAM  
·
Fast Access Times (max.):  
120, 150, 170, 200, 250ns  
·
Fully Static Operation  
- No clock or refresh required  
·
TTL Compatible Inputs  
and Outputs  
·
Common Data Inputs  
and Outputs  
·
10,000 Erase/Program  
Cycles (min.)  
·
66 - Pin PGA ‘’VERSA-STACK’’  
Package  
PIN-OUT DIAGRAM  
PIN NAMES  
A0 - A16  
I/O0 - I/O31  
CE0 - CE3  
WE0, WE1  
OE  
Address Inputs  
Data Input/Output  
Chip Enables  
Write Enables  
Output Enable  
Programming  
Voltage (+12.0V)  
VPP  
VDD  
VSS  
Power (+5V)  
Ground  
N.C.  
No Connect  
This document contains information on a product that is currently released  
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the  
right to change products or specifications herein without prior notice.  
30A072-11  
REV. A  
1
Powered by ICminer.com Electronic-Library Service CopyRight 2003  

与DPZ256X16IA3-15C相关器件

型号 品牌 获取价格 描述 数据表
DPZ256X16IA3-15I ETC

获取价格

x16 Flash EEPROM Module
DPZ256X16IA3-15M ETC

获取价格

x16 Flash EEPROM Module
DPZ256X16IA3-17B ETC

获取价格

x16 Flash EEPROM Module
DPZ256X16IA3-17C ETC

获取价格

x16 Flash EEPROM Module
DPZ256X16IA3-17I ETC

获取价格

x16 Flash EEPROM Module
DPZ256X16IA3-17M ETC

获取价格

x16 Flash EEPROM Module
DPZ256X16IA3-20B ETC

获取价格

x16 Flash EEPROM Module
DPZ256X16IA3-20C ETC

获取价格

x16 Flash EEPROM Module
DPZ256X16IA3-20I ETC

获取价格

x16 Flash EEPROM Module
DPZ256X16IA3-20M ETC

获取价格

x16 Flash EEPROM Module