Datasheet > DPZ256X16IA3-20B

DPZ256X16IA3-20B

更新时间： 2024-11-14 23:48:15

品牌	Logo	应用领域
其他 - ETC		闪存可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数	文件大小	规格书
14页	990K
描述
x16 Flash EEPROM Module

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数据手册

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DPZ256X16IA3-20B 数据手册

8 Megabit FLASH EEPROM

DPZ256X32IV3

DESCRIPTION:

The DPZ256X32IV3 ‘’VERSA-STACK’’ module is a

revolutionary new memory subsystem using Dense-Pac

Microsystems’ ceramic Stackable Leadless Chip Carriers

(SLCC) mounted on a co-fired ceramic substrate. It offers

8 Megabits of FLASH EEPROM in a single package

envelope of 1.090" x 1.090" x .252".

The DPZ256X32IV3 is built with four SLCC packages

each containing two 128K x 8 FLASH memory devices.

Each SLCC is hermetically sealed making the module

suitable for commercial, industrial and military

applications.

By using SLCCs, the ‘’Versa-Stack’’ family of modules

offers a higher board density of memory than available

with conventional through-hole, surface mount, module

or hybrid techniques.

FEATURES:

Organization:

256K x 32, 512K x 16

FUNCTIONAL BLOCK DIAGRAM

Fast Access Times (max.):

120, 150, 170, 200, 250ns

Fully Static Operation

- No clock or refresh required

TTL Compatible Inputs

and Outputs

Common Data Inputs

and Outputs

10,000 Erase/Program

Cycles (min.)

66 - Pin PGA ‘’VERSA-STACK’’

Package

PIN-OUT DIAGRAM

PIN NAMES

A0 - A16

I/O0 - I/O31

CE0 - CE3

WE0, WE1

Address Inputs

Data Input/Output

Chip Enables

Write Enables

Output Enable

Programming

Voltage (+12.0V)

V_PP

V_DD

V_SS

Power (+5V)

Ground

N.C.

No Connect

This document contains information on a product that is currently released

to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the

right to change products or specifications herein without prior notice.

30A072-11

REV. A

12 3 4 5 6 7...14

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