Datasheet > DPZ256X16IA3-17B

DPZ256X16IA3-17B

更新时间： 2024-09-23 23:48:15

品牌	Logo	应用领域
其他 - ETC		闪存内存集成电路可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数	文件大小	规格书
14页	990K
描述
x16 Flash EEPROM Module

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中文翻译

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数据手册

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DPZ256X16IA3-17B 数据手册

8 Megabit FLASH EEPROM

DPZ256X32IV3

DESCRIPTION:

The DPZ256X32IV3 ‘’VERSA-STACK’’ module is a

revolutionary new memory subsystem using Dense-Pac

Microsystems’ ceramic Stackable Leadless Chip Carriers

(SLCC) mounted on a co-fired ceramic substrate. It offers

8 Megabits of FLASH EEPROM in a single package

envelope of 1.090" x 1.090" x .252".

The DPZ256X32IV3 is built with four SLCC packages

each containing two 128K x 8 FLASH memory devices.

Each SLCC is hermetically sealed making the module

suitable for commercial, industrial and military

applications.

By using SLCCs, the ‘’Versa-Stack’’ family of modules

offers a higher board density of memory than available

with conventional through-hole, surface mount, module

or hybrid techniques.

FEATURES:

Organization:

256K x 32, 512K x 16

FUNCTIONAL BLOCK DIAGRAM

Fast Access Times (max.):

120, 150, 170, 200, 250ns

Fully Static Operation

- No clock or refresh required

TTL Compatible Inputs

and Outputs

Common Data Inputs

and Outputs

10,000 Erase/Program

Cycles (min.)

66 - Pin PGA ‘’VERSA-STACK’’

Package

PIN-OUT DIAGRAM

PIN NAMES

A0 - A16

I/O0 - I/O31

CE0 - CE3

WE0, WE1

Address Inputs

Data Input/Output

Chip Enables

Write Enables

Output Enable

Programming

Voltage (+12.0V)

V_PP

V_DD

V_SS

Power (+5V)

Ground

N.C.

No Connect

This document contains information on a product that is currently released

to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the

right to change products or specifications herein without prior notice.

30A072-11

REV. A

12 3 4 5 6 7...14

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