Datasheet > DPAF-23-03.0-H-3-1-K

DPAF-23-03.0-H-3-1-K

更新时间： 2024-10-29 05:23:51

品牌	Logo	应用领域
申泰 - SAMTEC		/
页数	文件大小	规格书
3页	959K
描述
Board Stacking Connector, 69 Contact(s), 3 Row(s), Female, Straight, Surface Mount Terminal,

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

DPAF-23-03.0-H-3-1-K 数据手册

浏览型号DPAF-23-03.0-H-3-1-K的Datasheet PDF文件第2页

浏览型号DPAF-23-03.0-H-3-1-K的Datasheet PDF文件第3页

NOTES:

DPAF-XX-03.0-X-X-X-XX

REVISION V

REPRESENTS A CRITICAL DIMENSION.

FIG 1

2. MINIMUM PUSHOUT FORCE: .75 LBS.

3. PARTS TO BE PACKAGED IN TRAYS.

OPTION

DPAF-23-03.0-X-8-1 SHOWN

No OF POSITIONS

4. MUST BE CHECKED ON EVERY 6 CONSECUTIVE PINS.

5. SEE RECOMMENDED FOOTPRINT DRAWING FOR STENCIL REQUIREMENTS.

6. MEASURE ON ALL 4 CORNERS OF THE ASSEMBLY, INCLUDING ADJACENT ROW.

(ALL CONTACTS NOT SHOWN FOR CLARITY)

-A: ALIGNMENT PIN

(SEE FIG 2, SHT 3)

-K: KAPTON PAD

(SEE FIG 3, SHT 3)

-TR: TAPE & REEL

-04, -06, -08, -15, -23, *-30

DO NOT

SCALE FROM

THIS PRINT

(PER ROW)

LEAD STYLE

(No OF POS) x .085 [2.16] + .171 [4.34] REF

-03.0

PLATING SPECIFICATION

SOLDER CRIMP MATERIAL

.149 3.79 REF

(No OF POS - 1) x .0850 [2.16] (TYP)

**-H: 30µ" HEAVY GOLD

IN CONTACT AREA,

MATTE TIN ON TAIL,

-S: 30µ" SELECTIVE GOLD

IN CONTACT AREA,

MATTE TIN ON TAIL.

-1: 63% TIN / 37% LEAD

(USE SUB-C-191-03.0-S-1)

-2: 96.5% TIN / 3% SILVER /

.5% COPPER

.0425 1.080

.085 2.16 (TYP)

(GROUND PIN)

(USE SUB-C-191-03.0-S-2)

"A"

ROW

-8: 8 DIFFERENTIAL PAIR ROWS

-3: 3 DIFFERENTIAL PAIR ROWS

.100 2.54

REF (TYP)

= NOT RELEASED FOR PRODUCTION

** = FOR EXISTING CUSTOMERS ONLY

"B" REF

"A" REF

PIN 2 (PAIR 1)

PIN 1 (PAIR 1)

.060 1.52

REF

"A"

.050 1.27 REF

PIN 4 (PAIR 2)

PIN 3 (PAIR 2)

.254 6.45

REF

.0045±.002 0.11±0.05

(SEE NOTE 6)

'C'

.085 2.16 (TYP)

.043 1.08 (TYP)

'B'

PATENT NUMBERS

6979238 / 7137832

6969286 / 7178232

7159312 / 7172438

7052337 / 7125293

DETAIL 'C'

(No OF POS - 1) x .0850 [2.16] (TYP)

CPC

SCALE 8 : 1

(ALL CONTACTS NOT

SHOWN FOR CLARITY)

PROPRIETARY NOTE

THIS DOCUMENT CONTAINS INFORMATION

CONFIDENTIAL AND PROPRIETARY TO

SAMTEC, INC. AND SHALL NOT BE REPRODUCED

OR TRANSFERRED TO OTHER DOCUMENTS OR

DISCLOSED TO OTHERS OR USED FOR ANY

PURPOSE OTHER THAN THAT WHICH IT WAS

OBTAINED WITHOUT THE EXPRESSED WRITTEN

CONSENT OF SAMTEC, INC.

UNLESS OTHERWISE SPECIFIED,

DIMENSIONS ARE IN INCHES.

FREQUENCY

THIS SHEET

.005 0.11 REF

TOLERANCES ARE:

DECIMALS

ANGLES

.XX: .01 [.3]

520 PARK EAST BLVD, NEW ALBANY, IN 47150

.XXX: .005 [.13]

PHONE: 812-944-6733

FAX: 812-948-5047

code: 55322

.XXXX: .0020 [.051]

e-Mail: info@SAMTEC.com

.010[0.25]

C9, C14

SHEET SCALE: 2:1

MATERIAL:

DO NOT SCALE DRAWING

DESCRIPTION:

INSULATOR: L.C.P., COLOR: BLACK

.085 PITCH DP SOCKET ASSEMBLY

CONTACT OR TERMINAL: COPPER ALLOY

.029 0.74

REF (TYP)

DETAIL 'B'

SCALE 4 : 1

DWG. NO.

DPAF-XX-03.0-X-X-X-XX

F:\DWG\MISC\MKTG\DPAF-XX-03.0-X-X-X-XX-MKT.SLDDRW

BY:

CHAD F

06/06/2003 SHEET 1 OF 3

12 3

中文翻译

下载PDF

与DPAF-23-03.0-H-3-1-K相关器件

型号	品牌	获取价格	描述	数据表
DPAF-23-03.0-H-3-2	SAMTEC	获取价格	Board Stacking Connector, 69 Contact(s), 3 Row(s), Female, Straight, Surface Mount Termina
DPAF-23-03.0-H-8-1-A	SAMTEC	获取价格	Board Stacking Connector, 336 Contact(s), 8 Row(s), Female, Straight, Surface Mount Termin
DPAF-23-03.0-H-8-1-A-TR	SAMTEC	获取价格	Board Stacking Connector, 368 Contact(s), 8 Row(s), Female, Straight, Surface Mount Termin
DPAF-23-03.0-H-8-2	SAMTEC	获取价格	Board Stacking Connector, 184 Contact(s), 8 Row(s), Female, Straight, Surface Mount Termin
DPAF-23-03.0-H-8-2-A	SAMTEC	获取价格	CONN ARRAY DIFF FEMALE 8X23PAIR
DPAF-2303.0H-8-2-A	SAMTEC	获取价格	Board Stacking Connector, 184 Contact(s), 8 Row(s), Female, Straight, Surface Mount Termin
DPAF-23-03.0-H-8-2-A-K	SAMTEC	获取价格	Board Stacking Connector, 368 Contact(s), 8 Row(s), Female, Straight, Surface Mount Termin
DPAF-23-03.0-S-3-1	SAMTEC	获取价格	Board Stacking Connector, 69 Contact(s), 3 Row(s), Female, Straight, Surface Mount Termina
DPAF-23-03.0-S-3-1-A	SAMTEC	获取价格	Board Stacking Connector,
DPAF-23-03.0-S-3-1-TR	SAMTEC	获取价格	Board Stacking Connector

与DPAF-23-03.0-H-3-1-K相关文章

三星深化印度制造布局，供应链本地化进程加速
2024-10-29

13
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

13
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
2024-10-18

39
意法半导体发布第四代SiC技术，助力电动汽车电驱
2024-10-15

46

产品中心

服务支持

精选活动

关于我们

帮助中心

DPAF-23-03.0-H-3-1-K

DPAF-23-03.0-H-3-1-K 数据手册

与DPAF-23-03.0-H-3-1-K相关器件

与DPAF-23-03.0-H-3-1-K相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

DPAF-23-03.0-H-3-1-K

DPAF-23-03.0-H-3-1-K 数据手册

与DPAF-23-03.0-H-3-1-K相关器件

与DPAF-23-03.0-H-3-1-K相关文章

您还可以找

您在本页遇到什么问题？