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Datasheet > DPAF-23-03.0-S-8-2-A-K-TR
DPAF-23-03.0-S-8-2-A-K-TR PDF预览

DPAF-23-03.0-S-8-2-A-K-TR

更新时间： 2024-10-28 20:46:43
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
1页 485K
描述
Board Connector, 368 Contact(s), 16 Row(s), Female, Straight, Surface Mount Terminal,

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DPAF-23-03.0-S-8-2-A-K-TR 技术参数

是否Rohs认证： 符合生命周期：Active
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8536.69.40.40Factory Lead Time：2 weeks
风险等级：5.78其他特性：STAGGERED CONFIGURATION
连接器类型：BOARD CONNECTOR联系完成终止：Gold (Au) - with Nickel (Ni) barrier
触点性别：FEMALEDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
JESD-609代码：e4MIL 符合性：NO
插接信息：MULTIPLE MATING PARTS AVAILABLE混合触点：NO
安装方式：STRAIGHT安装类型：BOARD
装载的行数：16选件：GENERAL PURPOSE
端子节距：2.16 mm端接类型：SURFACE MOUNT
触点总数：368Base Number Matches：1

DPAF-23-03.0-S-8-2-A-K-TR 数据手册

  
F-214  
DPAM–23–07.0–S–8–2–A  
DPAF–23–03.0–S–8–2–A  
®
(2,16 mm) .085"  
DPAM, DPAF SERIES  
HIGH DENSITY DIFFERENTIAL PAIR ARRAY  
DPAM Mates with:  
PAIRS  
PER ROW  
PLATING  
OPTION  
NO. OF  
ROWS  
SOLDER  
TYPE  
DPAF  
OPTION  
DPAM  
07.0  
A
DPAF Mates with:  
DPAM  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?DPAM or  
www.samtec.com?DPAF  
–8  
=Eight  
Pair  
–04, –06  
–08, –15, –23  
–2  
–K  
–S  
= Lead-Free  
Tin Alloy  
=(20,00 mm) 0.80"  
DIA Polyimide  
film Pick &  
=30µ" (0,76 µm)  
Gold on contact area,  
Tin on solder tail  
Rows  
96.5% Sn/  
3% Ag/.5% Cu  
Solder Crimp  
Place Pad  
–3  
=Three  
Pair  
Insulator Material:  
Black LCP  
Contact Material:  
Copper Alloy  
–TR  
Rows  
=Tape & Reel  
Perimeter  
Grounds (TYP)  
Plating:  
G1  
Au over 50µ" (1,27 µm) Ni  
Current Rating (2x3):  
2.9 A per pin  
(2,54)  
.100  
–GP  
=Guide Post  
(–23 only)  
Operating Temp Range:  
-55°C to +125°C  
Contact Resistance:  
10.4mΩ  
A
(2,54)  
.100  
Working Voltage:  
300 VAC  
02 01 G2 03 04  
NO OF  
ROWS  
Signal Pairs (TYP)  
No. of positions x (2,16) .085 + (4,34) .171  
A
Mated Cycles: 100 Cycles  
RoHS Compliant: Yes  
Lead-Free Solderable: Yes  
DPAM/DPAF  
10 mm Stack Height  
Rated @ 3dB Insertion Loss*  
(24,59) .968  
(11,89) .468  
–8  
–3  
(6,66)  
.262  
(0,13)  
.005  
Single-Ended Signaling  
Differential Pair Signaling  
*Performance data includes effects of a non-optimized PCB.  
8 GHz / 16 Gbps  
7 GHz / 14 Gbps  
RECOGNITIONS  
(1,27)  
.050  
DIA  
(2,16) .085  
For complete scope of  
recognitions see  
www.samtec.com/quality  
(1,27)  
.050  
(1,08) .0425  
Complete test data available at www.samtec.com?DPAM,  
www.samtec.com?DPAF or contact sig@samtec.com  
No. of positions x (2,16) .085 + (2,95) .116  
PAIRS  
PER ROW  
PLATING  
OPTION  
NO. OF  
ROWS  
SOLDER  
TYPE  
OPTION  
DPAF  
03.0  
A
–8  
Pair Rows  
–K  
=(20,00 mm)  
0.80" DIA  
Polyimide  
film  
Pick &  
Place Pad  
=Eight  
–S  
–2  
=30µ" (0,76 µm)  
Gold on contact area,  
Tin on solder tail  
= Lead-Free Tin Alloy  
96.5% Sn/ 3%Ag/  
.5% Cu  
–04, –06, –08,  
–15, –23  
–3  
Solder Crimp  
=Three  
Pair Rows  
No. of positions x (2,16) .085 + (4,34) .171  
Signal  
G1  
Pairs  
–TR  
=Tape  
& Reel  
USABLE PAIRS  
SIZE  
NO OF  
ROWS  
(TYP)  
A
PER ARRAY*  
6 Pairs  
–04 x –3  
–06 x –3  
–04 x –8  
–06 x –8  
–08 x –8  
–15 x –8  
–23 x –8  
–08 x –3  
–15 x –3  
–23 x –3  
A
(23,32)  
.918  
(10,62)  
.418  
04  
–8  
–3  
ALSO AVAILABLE  
12 Pairs  
16 Pairs  
32 Pairs  
48 Pairs  
(2,54)  
.100  
02  
01  
(1,52)  
.060  
(MOQ Required)  
G2  
03  
(1,27) .050  
Perimeter Grounds (TYP)  
Solder crimped on tail  
• Tin-Lead Solder Charge  
• Other platings  
Contact Samtec.  
DPAF  
DPAM  
104 Pairs  
168 Pairs  
18 Pairs  
39 Pairs  
63 Pairs  
MATED  
LEAD  
HEIGHT*  
(6,45)  
.254  
(0,13)  
.005  
STYLE  
–03.0  
10 mm  
–07.0  
Note: Patented  
(2,16) .085  
(1,08) .0425  
(1,27)  
.050  
DIA  
*Processing  
conditions will  
affect mated height.  
(1,27)  
.050  
Note: Some sizes, styles and  
options are non-standard,  
non-returnable.  
*Assumes first and last pair in  
each row are grounded  
No. of positions x (2,16) .085 + (2,95) .116  
WWW.SAMTEC.COM  
1

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