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DP83640TVVX/NOPB PDF预览

DP83640TVVX/NOPB

更新时间： 2024-02-02 02:18:14
品牌 Logo 应用领域
德州仪器 - TI 网络接口电信集成电路电信电路以太网：16GBASE-T
页数 文件大小 规格书
137页 1347K
描述
DP83640 Precision PHYTER - IEEE 1588 Precision Time Protocol Transceiver

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DP83640TVVX/NOPB 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active包装说明：GREEN, PLASTIC, LQFP-48
Reach Compliance Code：compliantECCN代码：5A991.B.1
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：1.48Is Samacsys：N
数据速率：100000 MbpsJESD-30 代码：S-PQFP-G48
JESD-609代码：e3长度：7 mm
湿度敏感等级：3功能数量：1
端子数量：48收发器数量：1
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：LFQFP
封装等效代码：QFP48,.35SQ,20封装形状：SQUARE
封装形式：FLATPACK, LOW PROFILE, FINE PITCH峰值回流温度（摄氏度）：260
电源：3.3 V认证状态：Not Qualified
座面最大高度：1.6 mm子类别：Network Interfaces
标称供电电压：3.3 V表面贴装：YES
技术：CMOS电信集成电路类型：ETHERNET TRANSCEIVER
温度等级：INDUSTRIAL端子面层：Matte Tin (Sn)
端子形式：GULL WING端子节距：0.5 mm
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：7 mmBase Number Matches：1

DP83640TVVX/NOPB 数据手册

 浏览型号DP83640TVVX/NOPB的Datasheet PDF文件第129页浏览型号DP83640TVVX/NOPB的Datasheet PDF文件第130页浏览型号DP83640TVVX/NOPB的Datasheet PDF文件第131页浏览型号DP83640TVVX/NOPB的Datasheet PDF文件第133页浏览型号DP83640TVVX/NOPB的Datasheet PDF文件第134页浏览型号DP83640TVVX/NOPB的Datasheet PDF文件第135页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Oct-2013  
PACKAGING INFORMATION  
Orderable Device  
DP83640TVV  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
LQFP  
LQFP  
LQFP  
PT  
48  
48  
48  
250  
TBD  
Call TI  
Call TI  
DP83640  
TVV  
DP83640TVV/NOPB  
DP83640TVVX/NOPB  
ACTIVE  
ACTIVE  
PT  
PT  
250  
Green (RoHS  
& no Sb/Br)  
CU SN | Call TI  
CU SN | Call TI  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-40 to 85  
DP83640  
TVV  
1000  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
DP83640  
TVV  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 1  
1...129130131132133134135...137

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