DMP2021UTS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
VDSS
Value
-20
Unit
V
Gate-Source Voltage
±10
V
VGSS
Steady
State
TA = +25°C
-7.4
-5.9
A
A
ID
TA = +70°C
TC = +25°C
TC = +70°C
Continuous Drain Current (Note 6) VGS = -4.5V
Steady
State
-18
-14
ID
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
A
A
IDM
Continuous Source-Drain Diode Current (Note 6)
TA = +25°C
IS
ISM
IAS
Pulsed Source-Drain Diode Current (10μs Pulse, Duty Cycle = 1%)
Avalanche Current (Note 7) L = 0.1mH
A
A
Avalanche Energy (Note 7) L = 0.1mH
mJ
EAS
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
PD
R
Value
0.9
Unit
W
Total Power Dissipation (Note 5)
TA = +25°C
Steady State
TA = +25°C
Steady State
Steady State
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
146
°C/W
W
JA
1.3
95
PD
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
R
JA
°C/W
°C
16
R
JC
-55 to +150
TJ, TSTG
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Symbol
Min
Typ
Max
Unit
Test Condition
-20
—
—
—
—
—
-1
V
BVDSS
IDSS
VGS = 0V, ID = -250μA
VDS = -20V, VGS = 0V
VGS = ±8V, VDS = 0V
µA
µA
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
—
±10
IGSS
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
-0.35
—
—
12
-1.0
16
V
mΩ
V
VGS(TH)
RDS(ON)
VSD
VDS = VGS, ID = -250μA
VGS = -4.5V, ID = -4.5A
VGS = -2.5V, ID = -4.5A
VGS = -1.8V, ID = -2.5A
VGS = 0V, IS = -1.0A
Static Drain-Source On-Resistance
15
22
19
40
—
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
-0.8
-1.2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2,760
262
220
16
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Ciss
Coss
Crss
Rg
VDS = -15V, VGS = 0V,
f = 1.0MHz
Output Capacitance
pF
Reverse Transfer Capacitance
Gate Resistance
Ω
VDS = 0V, VGS = 0V, f = 1MHz
34
Total Gate Charge (VGS = -4.5V)
Total Gate Charge (VGS = -8V)
Gate-Source Charge
Qg
59
Qg
nC
ns
VDS = -15V, ID = -4.0A
3.5
8.3
7.5
25
Qgs
Qgd
tD(ON)
tR
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
VDS = -15V, VGS = -4.5V,
RG = 1Ω, ID = -4.0A
125
96
Turn-Off Delay Time
tD(OFF)
tF
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
48
ns
tRR
IF = -1.0A, di/dt = 100A/μs
IF = -1.0A, di/dt = 100A/μs
33
nC
QRR
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C .
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
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www.diodes.com
July 2017
© Diodes Incorporated
DMP2021UTS
Document number: DS39575 Rev. 2 - 2