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DM2212J1-12I PDF预览

DM2212J1-12I

更新时间: 2024-01-07 08:35:12
品牌 Logo 应用领域
铁电 - RAMTRON 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
19页 156K
描述
Cache DRAM, 1MX4, 30ns, MOS, PDSO28, 0.300 INCH, PLASTIC, SO-28

DM2212J1-12I 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete包装说明:SOJ, SOJ28,.34
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.92
Is Samacsys:N访问模式:FAST PAGE/STATIC COLUMN
最长访问时间:30 ns其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SRAM
I/O 类型:COMMONJESD-30 代码:R-PDSO-J28
JESD-609代码:e0内存密度:4194304 bit
内存集成电路类型:CACHE DRAM内存宽度:4
功能数量:1端口数量:1
端子数量:28字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX4输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOJ
封装等效代码:SOJ28,.34封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V认证状态:Not Qualified
刷新周期:1024自我刷新:NO
最大待机电流:0.001 A子类别:DRAMs
最大压摆率:0.225 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:MOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:J BEND端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

DM2212J1-12I 数据手册

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are not allowed because a DRAM refresh cycle does not occur when  
a read refresh address matches the LRR address latch.  
/CAL — Column Address Latch  
This input is used to latch the column address and in combination  
with /WE to trigger write operations. When /CAL is high, the column  
address latch is transparent. When /CAL is low, the column address  
latch is closed and the output of the latch contains the address  
present while /CAL was high.  
Initialization Cycles  
A minimum of 10 initialization (start-up) cycles are required  
before normal operation is guaranteed. At least eight /F refresh  
cycles and two read cycles to different row addresses are necessary  
to complete initialization. /RE must be high for at least 300ns prior  
to initialization.  
W/R — Write/Read  
This input along with /F specifies the type of DRAM operation  
initiated on the low going edge of /RE. When /F is high, W/R  
specifies either a write (logic high) or read operation (logic low).  
Unallowed Mode  
Read, write, or /RE only refresh operations must not be  
performed to unselected memory banks by clocking /RE when /S is  
high.  
/F — Refresh  
This input will initiate a DRAM refresh operation using the  
internal refresh counter as an address source when it is low on the  
low going edge of /RE.  
Reduced Pin Count Operation  
Although it is desirable to use all EDRAM control pins to  
/WE — Write Enable  
optimize system performance, it is possible to simplify the interface  
to the EDRAM by either tying pins to ground or by tying one or  
more control inputs together. The /S input can be tied to ground if  
the low power standby modes are not required. The /CAL and /F  
pins can be tied together if hidden refresh operation is not  
required. In this case, a CBR refresh (/CAL before /RE) can be  
performed by holding the combined input low prior to /RE. A CBR  
refresh does not require that a row address be supplied when /RE  
is asserted. The timing is identical to /F refresh cycle timing. The  
/WE input can be tied to /CAL if independent posting of column  
addresses and data are not required during write operations. In  
this case, both column address and write data will be latched by  
the combined input during writes. W/R and /G can be tied together  
if reads are not performed during write hit cycles. If these  
techniques are used, the EDRAM will require only three control  
lines for operation (/RE, /CAS [combined /CAL, /F, and /WE], and  
W/R [combined W/R and /G]). The simplified control interface still  
allows the fast page read/write cycle times, fast random read/write  
times, and hidden precharge functions available with the EDRAM.  
This input controls the latching of write data on the input data  
pins. A write operation is initiated when both /CAL and /WE are low.  
/G — Output Enable  
This input controls the gating of read data to the output data  
pins during read operations.  
/S — Chip Select  
This input is used to power up the I/O and clock circuitry.  
When /S is high, the EDRAM remains in its low power mode. /S  
must remain active throughout any read or write operation. With  
the exception of /F refresh cycles, /RE should never be clocked  
when /S is inactive.  
DQ — Data Input/Output  
0-3  
These bidirectional data pins are used to read and write data  
to the EDRAM. On the DM2212 write-per-bit memory, these pins  
are also used to specify the bit mask used during write operations.  
A
0-10 Multiplex Address  
These inputs are used to specify the row and column  
addresses of the EDRAM data. The 11-bit row address is latched on  
the falling edge of /RE. The 9-bit column address can be specified  
at any other time to select read data from the SRAM cache or to  
specify the write column address during write cycles.  
Pin Descriptions  
/RE — Row Enable  
This input is used to initiate DRAM read and write operations  
and latch a row address. It is not necessary to clock /RE to read  
data from the EDRAM SRAM row registers. On read operations, /RE  
can be brought high as soon as data is loaded into cache to allow  
early precharge.  
V Power Supply  
CC These inputs are connected to the +5 or +3.3 volt power supply.  
V Ground  
SS  
These inputs are connected to the power supply ground  
connection.  
Pin Names  
Pin Names  
Function  
Pin Names  
Function  
A
Address Inputs  
Row Enable  
V
Ground  
0-10  
SS  
/WE  
Write Enable  
Output Enable  
Refresh Control  
/RE  
DQ  
/G  
Data In/Data Out  
0-3  
/CAL  
W/R  
Column Address Latch  
Write/Read Control  
Power (+5V or +3.3V)  
/F  
/S  
Chip Select - Active/Standby Control  
Not Connected  
V
NC  
CC  
1-22  

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