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DM2202T1-12L PDF预览

DM2202T1-12L

更新时间: 2024-02-03 03:54:49
品牌 Logo 应用领域
铁电 - RAMTRON 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
19页 156K
描述
Cache DRAM, 1MX4, 12ns, CMOS, PDSO44

DM2202T1-12L 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP, TSOP44,.36,32针数:44
Reach Compliance Code:unknown风险等级:5.8
Is Samacsys:N最长访问时间:12 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G44
JESD-609代码:e0内存密度:4194304 bit
内存集成电路类型:CACHE DRAM内存宽度:4
端子数量:44字数:1048576 words
字数代码:1000000最高工作温度:70 °C
最低工作温度:组织:1MX4
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP封装等效代码:TSOP44,.36,32
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度):240电源:3.3 V
认证状态:Not Qualified刷新周期:1024
自我刷新:YES最大待机电流:0.001 A
子类别:DRAMs最大压摆率:0.225 mA
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

DM2202T1-12L 数据手册

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read-modify-write, write-verify, or random read-write sequences  
within the page with 12ns cycle times (the first read cannot  
complete until after time tRAC2). At the end of a write sequence  
(after /CAL and /WE are brought high and tRE is satisfied), /RE can  
be brought high to precharge the memory. It is possible to perform  
cache reads concurrently with precharge. During write sequences,  
a write operation is not performed unless both /CAL and /WE are  
low. As a result, the /CAL input can be used as a byte write select in  
multi-chip systems. If /CAL is not clocked on a write sequence, the  
memory will perform a /RE only refresh to the selected row and  
data will remain unmodified.  
/CAL is clocked to latch the column address. The cache data is  
valid at time tAC after the column address is setup to /CAL.  
Internal Refresh  
If /F is active (low) on the assertion of /RE, an internal refresh  
cycle is executed. This cycle refreshes the row address supplied by  
an internal refresh counter. This counter is incremented at the end  
of the cycle in preparation for the next /F refresh cycle. At least  
1,024 /F cycles must be executed every 64ms. /F refresh cycles can  
be hidden because cache memory can be read under column  
address control throughout the entire /F cycle.  
Low Power Mode  
DRAM Write Miss  
The EDRAM enters its low power mode when /S is high. In this  
mode, the internal DRAM circuitry is powered down to reduce  
standby current to 1mA.  
If a DRAM write request is initiated by clocking /RE while W/R,  
/CAL, /WE, and /F are high, the EDRAM will compare the new row  
address to the LRR address latch (an 11-bit latch loaded on each  
/RE active read miss cycle). If the row address does not match, the  
EDRAM will write data to the DRAM array only and contents of the  
current cache are not modified. The write address and data are  
posted to the DRAM as soon as the column address is latched by  
bringing /CAL low and the write data is latched by bringing /WE  
low. The write address and data can be latched very quickly after  
the fall of /RE (tRAH + tASC for the column address and tDS for the  
data). During a write burst sequence, the second write data can be  
posted at time tRSW after /RE. Subsequent writes within a page can  
occur with write cycle time tPC. During a write miss sequence,  
cache reads are inhibited and the output buffers are disabled  
(independently of /G) until time tWRR after /RE goes high. At the  
end of a write sequence (after /CAL and /WE are brought high and  
tRE is satisfied), /RE can be brought high to precharge the memory.  
It is possible to perform cache reads concurrently with the  
precharge. During write sequences, a write operation is not  
performed unless both /CAL and /WE are low. As a result, /CAL can  
be used as a byte write select in multi-chip systems. If /CAL is not  
clocked on a write sequence, the memory will perform a /RE only  
refresh to the selected row and data will remain unmodified.  
Low Power, Self-Refresh Option  
When the low power, self refresh mode option is specified when  
ordering the EDRAM, the EDRAM enters this mode when /RE is  
clocked while /S, W/R, /F, and /WE are high; and /CAL is low. In this  
mode, the power is turned off to all I/O pins except /RE to minimize  
chip power, and an on-board refresh clock is enabled to perform self-  
refresh cycles using the on-board refresh counter. The EDRAM  
remains in this low power mode until /RE is brought high again to  
terminate the mode. The EDRAM /RE input must remain high for tRP2  
following exit from self-refresh mode to allow any on-going internal  
refresh to terminate prior to the next memory operation.  
Write-Per-Bit Operation  
The DM2212 version of the 1Mb x 4 EDRAM offers a write-per-  
bit capability which allows single bits of the memory to be selectively  
written without altering other bits in the same word. This capability  
may be useful for implementing parity or masking data in video  
graphics applications. The bits to be written are determined by a  
bit mask data word which is placed on the I/O data pins DQ prior  
to clocking /RE. The logic one bits in the mask data select t0h-e3 bits  
to be written. As soon as the mask is latched by /RE, the mask data  
is removed and write data can be placed on the databus. The mask  
is only specified on the /RE transition. During page mode burst  
write operations, the same mask is used for all write operations.  
/RE Inactive Operation  
It is possible to read data from the SRAM cache without clocking  
/RE. This option is desirable when the external control logic is  
capable of fast hit/miss comparison. In this case, the controller can  
avoid the time required to perform row/column multiplexing on hit  
cycles. This capability also allows the EDRAM to perform cache  
read operations during precharge and refresh cycles to minimize  
wait states and reduce power. It is only necessary to select /S and  
/G and provide the appropriate column address to read data as  
shown in the table below. The row address of the SRAM cache  
accessed without clocking /RE will be specified by the LRR address  
latch loaded during the last /RE active read cycle. To perform a  
cache read in static column mode, /CAL is held high, and the cache  
contents at the specified column address will be valid at time tAC  
after address is stable. To perform a cache read in page mode,  
+3.3 Volt Power Supply Operation  
If the +3.3 volt power supply option is specified, the EDRAM  
will operate from a +3.3 volt ±0.3 volt power supply and all inputs  
and outputs will have LVTTL/LVCMOS compatible signal levels. The  
+3.3 volt EDRAM will not accept input levels which exceed the  
power supply voltage. If mixed I/O levels are expected in your  
system, please specify the +5 volt version of the EDRAM.  
/CAL Before /RE Refresh (“/CAS Before /RAS)  
/CAL before /RE refresh, a special case of internal refresh, is  
discussed in the “Reduced Pin Count Operation” section below.  
/RE Only Refresh Operation  
Although /F refresh using the internal refresh counter is the  
recommended method of EDRAM refresh, it is possible to perform  
an /RE only refresh using an externally supplied row address. /RE  
refresh is performed by executing a write cycle (W/R and /F are  
high) where /CAL is not clocked. This is necessary so that the current  
cache contents and LRR are not modified by the refresh operation.  
Function  
/S  
L
/G /CAL  
A
0-8  
Cache Read (Static Column)  
Cache Read (Page Mode)  
L
L
H
Column Address  
Column Address  
All combinations of addresses A must be sequenced every 64ms  
L
0-9  
refresh period. A does not need to be cycled. Read refresh cycles  
10  
H = High; L = Low; X = Don’t Care; = Transitioning  
1-21  

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