CURRENT 1.0 Ampere
VOLTAGE 50 to 1000 Volts
DF005 THRU DF10
Features
· Glass Passivated Die Construction
· Diffused Junction
C
· Low Forward Voltage Drop, High Current Capability
· Surge Overload Rating to 50A Peak
B
A
E
· Designed for Printed Circuit Board Applications
· Plastic Material - UL Flammability Classification 94V-0
H
K
DF
D
J
Dim
A
Min
Max
7.90
6.50
0.30
2.03
8.90
4.69
8.51
2.60
5.20
0.58
7.40
6.20
0.22
1.27
7.60
3.81
8.13
2.40
5.00
0.46
G
L
B
Mechanical Data
C
D
E
· Case : Molded Plastic
· Terminals : Solder Plated Leads,
Solderable per MIL-STD-202, Method 208
· Polarity : As Marked on Case
· Approx. Weight : 0.38 grams
· Mounting Position : Any
G
H
J
K
L
· Marking : Type Number
All Dimens ions in mm
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
Symbols
Units
DF005 DF01 DF02 DF04 DF06 DF08 DF10
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
V
RMM
RWM
50
35
100
70
200
140
400
600
420
800
560
1000
700
Volts
R
RMS Reverse Voltage
V
RMS
280
1.0
Volts
Amp
Average Rectified Output Current @ T
A=40
Io
℃
Non-Repetitive Peak Forward Surge Current,
8.3ms single half-sine-wave superimposed
on rated load (JEDEC method)
I
FSM
50
Amps
V
FM
1.1
Volts
Forward Voltage (per element)
@ IF=1.0 A
@ T
A
A
=25℃
10
Peak Reverse Current at Rated
DC Blocking Voltage (per element)
I
RM
μA
@ T
=125℃
500
10.4
I2t Rating for Fusing (t<8.3ms)
I2t
A2
S
Typical Junction Capacitance
per element (Note 1)
C
j
25
40
pF
Typical Thermal Resistance,
Junction to Ambient (Note 2)
℃/W
RθJA
T
STG
j
Operating and Storage Temperature Range
-65 to +150
℃
T
Notes:
(1) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.
(2) Thermal Resistance, junction to ambient, measured on PC board with 5.02mm (0.03mm thick) land areas.