DE475-501N44A
RFꢀPowerꢀMOSFETꢀ
♦ꢁ NꢁChannelꢀEnhancementꢀModeꢀ
♦ꢁ LowꢀQgꢀandꢀRgꢀ
♦ꢁ Highꢀdv/dtꢀ
VDSS
ꢀ
=ꢀ 500ꢀVꢀ
♦ꢁ NanosecondꢀSwitchingꢀ
♦ꢁ 30MHzꢀMaximumꢀFrequencyꢀ
ID25ꢀ
=ꢀ
48ꢀAꢀ
RDS(on)ꢀ ≤ꢀ
0.13ꢀꢀꢀ
Symbolꢀ
VDSS
VDGR
VGS
VGSM
ID25
IDM
IAR
TestꢀConditionsꢀ
TJꢀ=ꢀ25°Cꢀtoꢀ150°Cꢀꢀ
TJꢀ=ꢀ25°Cꢀtoꢀ150°C;ꢀRGSꢀ=ꢀ1ꢀMꢀꢀꢀ
Continuousꢀ
MaximumꢀRatingsꢀꢀ
PDCꢀ
=ꢀ 1800Wꢀ
ꢀ
500ꢀ
500ꢀ
±20ꢀ
±30ꢀ
48ꢀ
Vꢀ
V
ꢀ
ꢀ
Vꢀ
Vꢀ
Aꢀ
Aꢀ
Aꢀ
Transientꢀ
ꢀ
Tcꢀ=ꢀ25°Cꢀꢀ
ꢀ
Tcꢀ=ꢀ25°C,ꢀpulseꢀwidthꢀlimitedꢀbyꢀTJMꢀꢀ
Tcꢀ=ꢀ25°Cꢀꢀ
ꢀ
288ꢀ
44ꢀ
ꢀ
Tcꢀ=ꢀ25°Cꢀꢀ
EAR
ꢀ
30ꢀ mJꢀ
5ꢀ V/nsꢀ
ISꢀ≤ꢁIDM,ꢀdi/dtꢀ≤ꢁꢀ100A/ꢂs,ꢀVDDꢀ≤ꢀVDSS,ꢀꢀ
Tjꢀ≤ꢀ150°C,ꢀRGꢀ=ꢀ0.2ꢀꢀꢀ
ꢀ
dv/dtꢀꢀ
ISꢀ=ꢀ0ꢀ
ꢀ
>200ꢀ V/nsꢀ
DRAIN
PDC
ꢀ
1800ꢀ
730ꢀ
Wꢀ
Wꢀ
GATE
Tcꢀ=ꢀ25°Cꢀ
Derateꢀ4.0W/°Cꢀaboveꢀ25°Cꢀ
PDHS
ꢀ
Tcꢀ=ꢀ25°Cꢀꢀ
PDAMB
ꢀ
4.5ꢀ
Wꢀ
ꢀ
ꢀ
RthJC
ꢀ
0.08ꢀ C/Wꢀ
0.20ꢀ C/Wꢀ
SG1 SG2
SD1
SD2
RthJHS
ꢀ
Featuresꢀ
•ꢁ IsolatedꢀSubstrateꢀ
−ꢁ highꢀisolationꢀvoltageꢀ(>2500V)ꢀ
−ꢁ excellentꢀthermalꢀtransferꢀ
Symbolꢀ
TestꢀConditions
CharacteristicꢀValuesꢀ
TJꢀ=ꢀ25°Cꢀunlessꢀotherwiseꢀspecifiedꢀꢀ
ꢀ
ꢀ
min.ꢀ
500ꢀ
typ.ꢀ
max.ꢀ ꢀ
−ꢁ Increasedꢀtemperatureꢀandꢀpowerꢀ
VGSꢀ=ꢀ0ꢀV,ꢀIDꢀ=ꢀ3ꢀmaꢀ
VDSꢀ=ꢀVGS,ꢀIDꢀ=ꢀ4ꢀmaꢀ
VGSꢀ=ꢀ±20ꢀVDC,ꢀVDSꢀ=ꢀ0ꢀ
cyclingꢀcapabilityꢀꢀꢀ
VDSS
VGS(th)
IGSS
IDSS
ꢀ
ꢀ
ꢀ
Vꢀ
Vꢀ
•ꢁ IXYSꢀadvancedꢀlowꢀQgꢀprocessꢀ
•ꢁ Lowꢀgateꢀchargeꢀandꢀcapacitancesꢀ
−ꢁ easierꢀtoꢀdriveꢀ
−ꢁ fasterꢀswitchingꢀ
•ꢁ LowꢀRDS(on)
ꢀ
3.5ꢀ
4.5ꢀ
5.5ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
±100ꢀ nAꢀ
VDSꢀ=ꢀ0.8ꢀVDSSꢀTJꢀ=ꢀ25°Cꢀꢀ
VGSꢀ=ꢀ0ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀTJꢀ=ꢀ125°Cꢀꢀ
ꢀ
ꢀ
50ꢀ
1ꢀ
ꢂAꢀ
mAꢀ
ꢀ
•ꢁ Veryꢀlowꢀinsertionꢀinductanceꢀ(<2nH)ꢀ
•ꢁ Noꢀberylliumꢀoxideꢀ(BeO)ꢀorꢀotherꢀhazꢁ
VGSꢀ=ꢀ15ꢀV,ꢀIDꢀ=ꢀ0.5ID25
Pulseꢀtest,ꢀtꢀ≤ꢀ300ꢂS,ꢀdutyꢀcycleꢀdꢀ≤ꢀ2%ꢀꢀ
ꢀ
RDS(on)
ꢀ
ꢀ
0.13ꢀ
ꢀꢀ
ardousꢀmaterialsꢀꢀ
ꢀ
Advantagesꢀ
VDSꢀ=ꢀ15ꢀV,ꢀIDꢀ=ꢀ0.5ID25,ꢀpulseꢀtestꢀ
gfsꢀ
TJꢀ
ꢀ
14ꢀ
ꢀ
ꢀ
Sꢀ
•ꢁ OptimizedꢀforꢀRFꢀandꢀhighꢀspeedꢀ
ꢀ
ꢁ55ꢀ
+175ꢀ °Cꢀꢀ
°Cꢀꢀ
+175ꢀ °Cꢀꢀ
switchingꢀatꢀfrequenciesꢀtoꢀ30MHzꢀ
•ꢁ Easyꢀtoꢀmount—noꢀinsulatorsꢀneededꢀ
ꢀ
TJM
Tstg
TLꢀ
ꢀ
ꢀ
ꢀ
175ꢀ
ꢀ
ꢀ
•ꢁ Highꢀpowerꢀdensityꢀ
ꢀ
ꢀ
ꢁ55ꢀ
1.6mmꢀ(0.063ꢀin)ꢀfromꢀcaseꢀforꢀ10ꢀsꢀ
ꢀ
ꢀ
ꢀ
300ꢀ
3ꢀ
ꢀ
ꢀ
°Cꢀꢀ
gꢀ
Weightꢀ