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CYK512K16SCAU-55BAXI PDF预览

CYK512K16SCAU-55BAXI

更新时间: 2024-02-14 06:10:54
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器
页数 文件大小 规格书
10页 177K
描述
8-Mbit (512K x 16) Pseudo Static RAM

CYK512K16SCAU-55BAXI 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:DSBGA包装说明:TFBGA, BGA48,6X8,30
针数:48Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.83Is Samacsys:N
最长访问时间:55 nsI/O 类型:COMMON
JESD-30 代码:R-PBGA-B48JESD-609代码:e1
长度:8 mm内存密度:8388608 bit
内存集成电路类型:PSEUDO STATIC RAM内存宽度:16
湿度敏感等级:3功能数量:1
端子数量:48字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-25 °C
组织:512KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA48,6X8,30封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.0001 A子类别:Other Memory ICs
最大压摆率:0.022 mA最大供电电压 (Vsup):3.3 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.75 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:20
宽度:6 mmBase Number Matches:1

CYK512K16SCAU-55BAXI 数据手册

 浏览型号CYK512K16SCAU-55BAXI的Datasheet PDF文件第1页浏览型号CYK512K16SCAU-55BAXI的Datasheet PDF文件第2页浏览型号CYK512K16SCAU-55BAXI的Datasheet PDF文件第3页浏览型号CYK512K16SCAU-55BAXI的Datasheet PDF文件第5页浏览型号CYK512K16SCAU-55BAXI的Datasheet PDF文件第6页浏览型号CYK512K16SCAU-55BAXI的Datasheet PDF文件第7页 
CYK512K16SCCA  
MoBL®  
AC Test Loads and Waveforms  
R1  
ALL INPUT PULSES  
90%  
10%  
VCC  
OUTPUT  
VCC  
90%  
10%  
GND  
Fall Time = 1 V/ns  
R2  
30 pF  
Rise Time = 1 V/ns  
INCLUDING  
JIG AND  
SCOPE  
Equivalent to: THEVENIN EQUIVALENT  
RTH  
OUTPUT  
VTH  
Parameters  
3.0V VCC  
22000  
22000  
11000  
1.50  
Unit  
R1  
R2  
RTH  
VTH  
V
Switching Characteristics (Over the Operating Range) [10, 11, 12, 13, 14]  
CYK512K16SCCA-55  
CYK512K16SCCA-70  
Parameter  
Description  
Min.  
55[14]  
5
Max.  
Min.  
Max.  
Unit  
Read Cycle  
tRC  
Read Cycle Time  
70  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tAA  
Address to Data Valid  
55  
70  
tOHA  
tACE  
Data Hold from Address Change  
CE1 LOW and CE2 HIGH to Data Valid  
OE LOW to Data Valid  
OE LOW to Low Z[11, 12]  
OE HIGH to High Z[11, 12]  
CE1 LOW and CE2 HIGH to Low Z[11, 12]  
CE1 HIGH and CE2 LOW to High Z[11, 12]  
BLE/BHE LOW to Data Valid  
BLE/BHE LOW to Low Z[11, 12]  
BLE/BHE HIGH to High-Z[11, 12]  
Address Skew  
5
55  
25  
70  
35  
tDOE  
tLZOE  
tHZOE  
tLZCE  
tHZCE  
tDBE  
5
5
5
5
25  
25  
25  
55  
25  
70  
tLZBE  
tHZBE  
5
5
10  
0
25  
10  
[14]  
tSK  
Notes:  
10. Test conditions assume signal transition time of 1V/ns or higher, timing reference levels of V  
/2, input pulse levels of 0V to V  
and output loading of  
CC(typ)  
CC(typ),  
the specified I /I and 30-pF load capacitance  
OL OH  
11. t  
, t  
, t  
and t  
transitions are measured when the outputs enter a high-impedance state.  
HZOE HZCE HZBE  
HZWE  
12. High-Z and Low-Z parameters are characterized and are not 100% tested.  
13. The internal write time of the memory is defined by the overlap of WE, CE = V , CE = V , BHE and/or BLE =V . All signals must be ACTIVE to initiate a write  
1
IL  
2
IH  
IL  
and any of these signals can terminate a write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal that  
terminates write.  
14. To achieve 55-ns performance, the read access should be CE controlled. In this case t  
is the critical parameter and t is satisfied when the addresses are  
ACE  
SK  
stable prior to chip enable going active. For the 70-ns cycle, the addresses must be stable within 10 ns after the start of the read cycle.  
Document #: 38-05425 Rev. *E  
Page 4 of 10  

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