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CY7C199-12ZXC PDF预览

CY7C199-12ZXC

更新时间: 2024-11-29 04:10:31
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
11页 315K
描述
32K x 8 Static RAM

CY7C199-12ZXC 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSOP包装说明:TSOP1,
针数:28Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.41
风险等级:5.23最长访问时间:12 ns
JESD-30 代码:R-PDSO-G28长度:11.8 mm
内存密度:262144 bit内存集成电路类型:STANDARD SRAM
内存宽度:8功能数量:1
端子数量:28字数:32768 words
字数代码:32000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:32KX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.02 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.55 mm
端子位置:DUAL宽度:8 mm
Base Number Matches:1

CY7C199-12ZXC 数据手册

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CY7C199  
32K x 8 Static RAM  
Functional Description  
Features  
• High speed  
The CY7C199 is a high-performance CMOS static RAM  
organized as 32,768 words by 8 bits. Easy memory expansion  
is provided by an active LOW Chip Enable (CE) and active  
LOW Output Enable (OE) and tri-state drivers. This device has  
an automatic power-down feature, reducing the power  
consumption by 81% when deselected. The CY7C199 is in the  
standard 300-mil-wide DIP, SOJ, and LCC packages.  
— 12 ns  
• Fast tDOE  
• CMOS for optimum speed/power  
• Low active power  
— 495 mW (Max, “L” version)  
• Low standby power  
An active LOW Write Enable signal (WE) controls the  
writing/reading operation of the memory. When CE and WE  
inputs are both LOW, data on the eight data input/output pins  
(I/O0 through I/O7) is written into the memory location  
addressed by the address present on the address pins (A0  
through A14). Reading the device is accomplished by selecting  
the device and enabling the outputs, CE and OE active LOW,  
while WE remains inactive or HIGH. Under these conditions,  
the contents of the location addressed by the information on  
address pins are present on the eight data input/output pins.  
— 0.275 mW (Max, “L” version)  
• 2V data retention (“L” version only)  
• Easy memory expansion with CE and OE features  
• TTL-compatible inputs and outputs  
• Automatic power-down when deselected  
• Available in pb-free 28-pin TSOP I and 28-pin (300-Mil)  
Molded DIP  
The input/output pins remain in a high-impedance state unless  
the chip is selected, outputs are enabled, and Write Enable  
(WE) is HIGH. A die coat is used to improve alpha immunity.  
Pin Configurations  
Logic Block Diagram  
DIP  
Top View  
A
A
V
CC  
28  
27  
26  
1
2
3
4
5
6
5
WE  
A
4
6
A
A
7
8
A
3
25  
24  
A
9
A
2
A
10  
A
11  
23  
22  
A
1
7
OE  
A
A
A
I/O  
I/O  
I/O  
21  
20  
19  
18  
17  
16  
15  
A
12  
13  
14  
8
9
10  
11  
12  
13  
0
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
CE  
I/O  
I/O  
I/O  
0
1
2
3
4
5
6
INPUT BUFFER  
7
0
1
2
6
5
4
A
0
A
I/O  
I/O  
1
A
GND  
14  
2
3
A
3
A
4
22  
23  
OE  
A
32K x 8  
ARRAY  
21  
20  
A
0
A
5
1
CE  
I/O  
I/O  
I/O  
I/O  
I/O  
A
6
A
A
A
24  
2
3
4
19  
18  
17  
16  
7
6
A
7
25  
26  
27  
28  
1
A
8
5
4
3
A
9
TSOP I  
Top View  
(not to scale)  
WE  
V
CC  
15  
14  
13  
A
A
A
A
A
5
6
7
GND  
I/O  
CE  
WE  
2
3
POWER  
DOWN  
2
COLUMN  
DECODER  
I/O  
1
12  
11  
4
5
8
9
I/O  
A
0
14  
I/O  
7
OE  
10  
9
A
6
10  
A
A
13  
12  
A
7
11  
8
Selection Guide  
–12  
12  
–15  
15  
–20  
20  
Unit  
ns  
Maximum Access Time  
Maximum Operating Current  
160  
155  
90  
10  
150  
mA  
L
L
Maximum CMOS Standby Current  
10  
10  
mA  
0.05  
Cypress Semiconductor Corporation  
Document #: 38-05160 Rev. *B  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised August 3, 2006  

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